NeoDen 4 - Default Chapter; Table of Contents

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1.Structure of Neoden 4.................................................................................................................. 6

1.1.Brief Introduction..................................................................................................................6

1.2.Structure of NeoDen 4.......................................................................................................... 7

2.Operation Flow Chart....................................................................................................................8

3.Procedure for making a programming file..................................................................................9

4.Edit on the Operation Interface..................................................................................................10

4.1Edit on the Interface.............................................................................................................10

4.1.1.PCB Feeding Setting................................................................................................10

（1） Tray fixed...................................................................................................... 10

（2） Rail once....................................................................................................... 10

（3） Rail multi.......................................................................................................11

（4） Eject front......................................................................................................11

4.1.2.Setting Panelized PCB & first chip( manual is the same as automatic download)............. 11

（1） Single PCB....................................................................................................12

（2） Panelized PCB.............................................................................................. 12

（3） PCB angle correction....................................................................................13

（4） Bad PCB detection........................................................................................13

4.1.3.PCB mark point setting............................................................................................13

（1） Single PCB....................................................................................................13

（2） Panelized PCB.............................................................................................. 13

（3） Maunal.......................................................................................................... 14

（4） Add or delete mark point.............................................................................. 14

4.1.4.Chip list setting........................................................................................................ 15

（1） Manual program............................................................................................15

（2） Import PCB BOM File..................................................................................16

4.1.5.Feeder configuration................................................................................................ 17

（1） Feed setting................................................................................................... 17

（2） System setting............................................................................................... 17

4.2.File mounting...................................................................................................................... 21

4.3.Manual test.......................................................................................................................... 22

4.3.1.Placement head........................................................................................................ 22

4.3.2.Rails control............................................................................................................. 23

4.3.3.Host control..............................................................................................................23

4.3.4.Feeder test................................................................................................................ 24

4.4.Factory settings................................................................................................................... 24

4.4.1Feeder configuration................................................................................................. 26

4.4.2.Feed setting.......................................................................................................... …29

4.4.3.Peel Configuration ……………………………………………………………… 30

4.4.4.System setting.......................................................................................................... 31

4.5.First trial and testing........................................................................................................... 33

4.6Continuous SMT production................................................................................................34