1-9-4
Hi-Fi Audio Block Diagram
HG470BLH
ENV
DET
LOGIC
R
L
HOLD
PULSE
LIM
OUTPUT
SELECT
REC-AUDIO SIGNALPB-AUDIO SIGNAL Mode : SP/REC
IIC-BUS SDA
IIC-BUS SCL
A-MODE
LINE-MUTE
MUTE
MUTE-ON
MUTE-ON
Hi-Fi-H-SW
" " = SMD
NOTE FOR WIRE CONNECTORS:
1. PREFIX SYMBOL "CN" MEANS CONNECTOR.
(CAN DISCONNECT AND RECONNECT.)
2. PREFIX SYMBOL "CL" MEANS WIRE-SOLDER
HOLES OF THE PCB.
(WIRE IS SOLDERED DIRECTLY.)
TEST POINT INFORMATION
:INDICATES A TEST POINT WITH A JUMPER WIRE ACROSS A HOLE IN THE PCB.
:USED TO INDICATE A TEST POINT WITH A COMPONENT LEAD ON FOIL SIDE.
:USED TO INDICATE A TEST POINT WITH NO TEST PIN.
:USED TO INDICATE A TEST POINT WITH A TEST PIN.
IF SIGNAL
PROCESS
N-A-REC
TO AUDIO BLOCK
N-A-PB
AFV CBA
TU-AUDIO(R)
4
TU-AUDIO(L)
5
4
5
CN701 CN1
SIF
2
2
CN701
CN1
TU701
AUDIO IN
SIF OUT
2
22
JACK CBA
MAIN CBA
JK101
A-IN1(R)
A-IN1(L)
2
6
2
6
1
3
1
3
JK102
CL151
CL152
CL101
CL102
A-IN2(R)
A-IN2(L)
A-OUT1(R)
A-OUT1(L)
A-OUT2(R)
A-OUT2(L)
A-IN2(R)
(Hi-Fi AUDIO SIGNAL PROCESS)
9
A-IN2(L) 8
9
8
A-OUT2(R)
6
A-OUT2(L) 11
6
11
A-IN1(R)
9
A-IN1(L) 7
9
7
A-OUT1(R)
5
A-OUT1(L) 11
5
11
IC451
Hi-Fi
AUDIO
(R) HEAD
Hi-Fi
AUDIO
(L) HEAD
CYLINDER
ASSEMBLY
Hi-Fi-A(R) 7
Hi-Fi-COM 8
Hi-Fi-A(L) 9
CL253
48
47
14
15
R-CH
INSEL
L-CH
INSEL
ALC
SW
SW
ALC
62
61 71
70
24
26
27
34 33
L-CH
BPF
COMP
SW
NOISE
COMP
SW
NOISE
R-CH
BPF
VCO
LPF
LIM DEV
VCO
LPF
LIM DEV
MIX V/I
NOISE
DET
DO
DET
P
P
R
R
VCO MUTE
73
74
72
76
77
75
37
38
21
53
39
L-CH
PNR
ALC
R-CH
PNR
ALC
67
65
52
56
54
50
60
2
6
10
8
4
78
80
+
Q451
FROM/TO
SERVO/SYSTEM
CONTROL BLOCK
(DECK ASSEMBLY)
(TUNER UNIT)
To Next Page
Loading...
