LTE Standard Module Series
EG91 Series Hardware Design
EG91_Series_Hardware_Design 88 / 106
Figure 39: Referenced Heatsink Design (Heatsink at the Top of the Module)
Figure 40: Referenced Heatsink Design (Heatsink at the Backside of Customers’ PCB)
The module offers the best performance when the internal BB chip stays below 105°C. When the
maximum temperature of the BB chip reaches or exceeds 105°C, the module works normal but provides
reduced performance (such as RF output power, data rate, etc.). When the maximum BB chip
temperature reaches or exceeds 115°C, the module will disconnect from the network, and it will recover to
network connected state after the maximum temperature falls below 115°C. Therefore, the thermal design
should be maximally optimized to make sure the maximum BB chip temperature always maintains below
NOTE
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