5G Module Series
RM500Q-GL Hardware Design
RM500Q-GL_Hardware_Design 7 / 85
6.7. Operating and Storage Temperatures ...................................................................................... 78
7 Mechanical Dimensions and Packaging ......................................................................................... 79
7.1. Mechanical Dimensions of the Module ..................................................................................... 79
7.2. Top and Bottom Views of the Module ....................................................................................... 80
7.3. M.2 Connector ........................................................................................................................... 80
7.4. Packaging ................................................................................................................................. 81
8 Appendix References ........................................................................................................................ 82
To Next Page
Loading...
Need help?
General
