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Sony FMP-X10 - Diagrams and Schematics; Board Layout and Schematic Overview

Sony FMP-X10
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FMP-X10 24
SECTION 4 - DIAGRAMS
CIRCUIT BOARDS LOCATION
MAIN BOARD
(SAL-1001 BOARD)
WIRELESS
LAN CARD
PF-1001 BOARD
BOARD LAYOUT
PRINTED CIRCUIT BOARDS AND SCHEMATIC DIAGRAMS INFORMATION
All capacitors are in µF unless otherwise noted. pF : µµF 50WV or less are not indicated except for electrolytics and tantalums.
All electrolytics are in 50V unless otherwise specied.
All resistors are in ohms. k=1000, M=1000k
Indication of resistance, which does not have one for rating electrical power, is as follows: Pitch : 5mm
Rating electrical power :
1
/
4
W
1
/
4
W in resistance,
1
/
10
W and
1
/
16
W in chip resistance.
: nonammable resistor
: fusible resistor
: internal component
: panel designation and adjustment for repair
: earth ground
: earth-chassis
All variable and adjustable resistors have characteristic curve B, unless otherwise noted.
Readings are taken with a color-bar signal input.
Readings are taken with a 10M digital multimeter.
Voltages are DC with respect to ground unless otherwise noted.
Voltage variations may be noted due to normal production tolerances.
All voltages are in V.
S : Measurement impossibility.
: B+line.
: B-line. (Actual measured value may be different).
: signal path. (RF)
Circled numbers are waveform references.
NOTE: The components identied by shading and
!
or dotted Line with mark
!
on the schematic diagrams and in the part list are critical to safe operation.
Replace these components with SONY parts whose part numbers appear as shown
in this manual or in supplements published by SONY.
The symbol indicates a fast-blow fuse and is displayed on the component
side of the board. Replace only with fuse of the same rating as marked.
NOTE: The components identied by a red outline and a mark contain condential
information. Specic instructions must be adhered to whenever these components
are repaired and/or replaced.
See Appendix A: Encryption Key Components in the back of this manual.
COIL
: LF-8L MICRO INDUCTOR
CAPACITOR
: TA TANTALUM
: PS STYROL
: PP POLYPROPYLENE
: PT MYLAR
: MPS METALIZED POLYESTER
: MPP METALIZED POLYPROPYLENE
: ALB BIPOLAR
: ALT HIGH TEMPERATURE
: ALR HIGH RIPPLE
G
D
S
B1 E1
C2
B2 C1E2
2
3
4
5
6
7
8
9
1
G
D
S
B2 E2
C1
B1 C2
E1
B2 E2C1
B1 C2E1
B2 E2C1
B1 C2E1
B1 E1
E2
C1(B2)
C2
B1
E2
C1
C2
(B2)
E1
(B2)
E1
E2
B1
C2C1
B1
E1
C2
B2
C1
E2
G
S
S
D
G
D
B1
E1
C2
B2
C1
E2
B1
E2
C2C1(B2)
E2
B1
C1
C2E1(B2)
C2
B1
C1
E2E1(B2)
C2
B1
C1
E2
B2
E1
C2
Ver.1.6
Transistor
(FET)
Transistor
Transistor
Transistor
Transistor
Transistor
Transistor
Transistor
Transistor
Transistor
Discrete semiconductor
(Chip semiconductors that are not actually used are included.)
Diode
Diode
Diode
Diode
Diode
Diode
Diode
Diode
Diode
Diode
Source
Source
Anode
Anode
(NC)
(NC)
Cathode
Anode
Cathode
Common
Cathode
Cathode
Common
Cathode
Cathode
Common
Common
Common
Common
Cathode
Anode
Base
Emitter
Collector
Base
Emitter
Collector
Drain
Gate
Gate
Drain
Device Printed symbol Terminal name
Circuit
Terminal name of semiconductors in silk screen
printed circuit ( )
Anode
Anode
Anode Cathode
Anode Anode
Cathode
Transistor
(FET)
Transistor
(FET)
Emitter
Collector
Base
Transistor
Source
Gate
Drain
Cathode
Anode
Anode
Cathode
Anode
Anode
*
18
11
17
16
15
14
13
12
10
21
20
19
23
22
RESISTOR
: RN METAL FILM
: RC SOLID
: FPRD NONFLAMMABLE CARBON
: FUSE NONFLAMMABLE FUSIBLE
: RW NONFLAMMABLE WIREWOUND
: RS NONFLAMMABLE METAL OXIDE
: RB NONFLAMMABLE CEMENT
: ADJUSTMENT RESISTOR
REFERENCE INFORMATION

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