Sony HCD-CP11 - 6 Diagrams; Circuit Boards Locations -Escs:ccrrerteeeeeeseeeeeeeeeeeeeaeecsnesenaeees

SECTION 6
DIAGRAMS
NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGARAMS
Note on Printed Wiring Board: Note on Schematic Diagram:
* o——— : parts extracted from the component side. * Allcapacitors are in pF unless otherwise noted. pF: uF
° : parts extracted from the conductor side. 50 WV or less are not indicated except for electrolytics
: Pattern from the side which enables seeing. and tantalums.
¢ All resistors are in Q and ‘/4 W or less unless otherwise
specified.
* A internal component.
¢ (~~ : panel designation.
* Waveforms Note: ee fer
Ss “. The components identi- es composants identifiés par
MAN Board fied by mark A\ or dotted | une marque A\ sont critiques:
SSS ee ee line with mark A\ are criti- | pour la sécurité.
cal for safety. Ne les remplacer que par une
® IC801 Replace only with part | piéce portant le numéro
number specified. spécifié.
° : B+ Line.
e : B- Line.
4.6Vp-p ¢ [=] : adjustment for repair.
238ns * Voltages are taken with a VOM (Input impedance 10 MQ).
Voltage variations may be noted due to normal produc-
tion tolerances.
Q) IC801 @ * Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
* Circled numbers refer to waveforms.
¢ Signal path.
“30.5us 5.0Vp-p > :TUNER
) _ : TAPE PLAY
)) : TAPE RECORD
> -:CD PLAY (ANALOG OUT)
@) ics04 @ > :CD PLAY (OPTICAL OUT)
e
Abbreviation
EA _ : Saudi Arabia model.
AUS : Australian model.
SP —_: Singapore model.
MY _ : Malaysia model.
peer 4.3Vp-p TW __: Taiwan model.
HK — : Hong Kong model.
AR _ : Argentine model.
CND_ : Canadian model.
AED: North European model.
MX — : Mexican model.
KR _— : Korean model.
6-1. CIRCUIT BOARDS LOCATION SPEAKER board
POWER board
LCD board
MAIN board
HEADPHONE board
CONTROL board
LOADING board
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