Sony MXD-D3 - DIAGRAMS; Printed Wiring Board and Schematic Notes; Circuit Boards Location Diagram

4141
MXD-D3
SECTION 6
DIAGRAMS
6-1. NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
(In addition to this, the necessary note is printed in each block)
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and
1
/
4
W or less unless otherwise
specified.
• % : indicates tolerance.
•
f
: internal component.
• 5 : fusible resistor.
• C : panel designation.
Note on Printed Wiring Board:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
•
a
: Through hole.
• b : Pattern from the side which enables seeing.
• U : B+ Line.
• V : B– Line.
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
J : CD PLAY
E : MD PLAY
j : MD REC
B
These are omitted.
CE
Q
B
These are omitted.
CE
Q
• Indication of transistor.
Note:
The components identi-
fied by mark 0 or dotted
line with mark 0 are criti-
cal for safety.
Replace only with part
number specified.
Note:
Les composants identifiés par
une marque 0 sont critiques
pour la sécurité.
Ne les remplacer que par une
piéce portant le numéro
spécifié.
Caution:
Pattern face side: Parts on the pattern face side seen from
(Side B) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Side A) the parts face are indicated.
• Circuit Boards Location
TRANS board
MAIN boar
d
PWSW board
DISPLAY board
HP board
BD (CD) board
LOADING board
SW board
BD (MD) boar
d