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ST STM32F20 Series User Manual

ST STM32F20 Series
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Page #21 background image
AN3320 Recommendations
Doc ID 18267 Rev 2 21/29
5 Recommendations
5.1 Printed circuit board
For technical reasons, it is best to use a multilayer printed circuit board (PCB) with a
separate layer dedicated to ground (V
SS
) and another dedicated to the V
DD
supply. This
provides good decoupling and a good shielding effect. For many applications, economical
reasons prohibit the use of this type of board. In this case, the major requirement is to
ensure a good structure for ground and for the power supply.
5.2 Component position
A preliminary layout of the PCB must separate the different circuits according to their EMI
contribution in order to reduce cross-coupling on the PCB, that is noisy, high-current circuits,
low-voltage circuits, and digital components.
5.3 Ground and power supply (V
SS
, V
DD
)
Every block (noisy, low-level sensitive, digital, etc.) should be grounded individually and all
ground returns should be to a single point. Loops must be avoided or have a minimum area.
The power supply should be implemented close to the ground line to minimize the area of
the supply loop. This is due to the fact that the supply loop acts as an antenna, and is
therefore the main transmitter and receiver of EMI. All component-free PCB areas must be
filled with additional grounding to create a kind of shielding (especially when using single-
layer PCBs).
5.4 Decoupling
All power supply and ground pins must be properly connected to the power supplies. These
connections, including pads, tracks and vias should have as low impedance as possible.
This is typically achieved with thick track widths and, preferably, the use of dedicated power
supply planes in multilayer PCBs.
In addition, each power supply pair should be decoupled with filtering Ceramic capacitors C
(100 nF) and one single Tantalum or Ceramic capacitor (min. 4.7 µF typ.10 µF) connected in
parallel on the STM32F20xxx/21xxx device. These capacitors need to be placed as close as
possible to, or below, the appropriate pins on the underside of the PCB. Typical values are
10 nF to 100 nF, but exact values depend on the application needs. Figure 13 shows the
typical layout of such a V
DD
/V
SS
pair.

Table of Contents

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ST STM32F20 Series Specifications

General IconGeneral
BrandST
ModelSTM32F20 Series
CategoryMicrocontrollers
LanguageEnglish

Summary

Power Supplies

Voltage Regulator Operation

Explains the embedded voltage regulator and its operating modes.

Power Supply Schemes and Decoupling

Describes recommended external power supply connections and decoupling.

Power-On/Power-Down Reset (POR/PDR)

Details the integrated POR/PDR circuitry and its operation.

Programmable Voltage Detector (PVD)

Explains the PVD for monitoring VDD supply and generating interrupts.

Clock Management

Clock Security System (CSS)

Explains the CSS for detecting HSE oscillator failures.

Boot Configuration

Boot Mode Selection Methods

How to select boot modes using BOOT pins.

Embedded Boot Loader Mode

Describes the embedded boot loader for Flash memory reprogramming.

Debug Management

SWJ Debug Port (Serial Wire & JTAG)

Explains the integrated SWJ-DP port combining JTAG and SW modes.

SWJ Debug Port Pin Configuration

Identifies the specific pins used for SWJ-DP functionality.

SWJ Debug Port to JTAG Connector

Shows the pin connections for SWJ-DP to a standard JTAG connector.

Design Recommendations

Decoupling Capacitor Strategy

Recommendations for decoupling capacitors for power supply stability.

Reference Design

Reference Design Component List

Lists mandatory and optional components for the reference design.

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