Maintenance-314  Service 
Troubleshooting Techniques 
This troubleshooting  procedure is arranged to check 
the simple trouble possibilities  before proceeding with 
extensive procedures. The first few checks ensure proper 
connections, operation, and calibration. If the trouble is 
not located by these checks, the remaining steps aid in 
locating defective components. 
1.  Check  Control Settings. 
lncorrect control settings 
can indicate a trouble that does not exist. If there is any 
question about the correct function or operation of any 
control, see the Operators Manual. 
2.  Check Associated  Equipment. 
Before  proceeding 
with troubleshooting, be certain that the equipment used 
with the 314 is operating and connected correctly. Check 
for a defective power supply and interconnecting cables. 
3. 
Visual  Check. 
Many troubles (such as unsoldered 
connections,  broken  wires,  damaged  circuit  boards, 
damaged  components,  etc.)  can  be  located  by visual 
inspection. 
4.  Check  Instrument  Calibration. 
Check the calibra- 
tion of the instrument, or the affected circuit if the trouble 
appears to be in one circuit. The apparent trouble may be a 
result of misadjustment and may be corrected by readjust- 
ment. Complete adjustment instructions are given  in the 
Adjustment  Procedure. 
5. 
Isolate Trouble to a Circuit. 
To isolate trouble to a 
circuit, note  the  trouble symptom. The symptom often 
identifies the circuit in which the trouble is located. For 
example,  poor  focus  indicates  that  the  crt  circuit  is 
probably at fault. When trouble symptoms appear in more 
than one circuit, check the affected circuits by checking 
voltages. 
lncorrect operation of all circuits often indicates trou- 
ble in the power supply. Check first for correct voltagesof 
the  individual  supplies  and  determine  if  one  or  more 
supplies is out of regulation. However, a defective compo- 
nent elsewhere in the instrument can appear as a 
power- 
supply trouble and may affect operation of other circuits. 
If  incorrect  operation  of  the  power  supplies  is 
suspected, check each supply for correct voltage (use a 
digital voltmeter, preferably one that is accurate to within 
0.1%) and check ripple with a test oscilloscope. See Table 
4-1 for voltage and ripple 
tolerqnces. The voltages shown 
in Table 4-1 are measured between the power-supply test 
points and chassis ground. Power-supply test points are 
shown in Fig. 4-2. 
TABLE 4-1 
Voltage and Ripple Tolerances 
Accuracy  Accuracy 
(initial)'  (after 200 hrs)'  Ripple 
supply  within  within 
+6 
V 
3 
Oh 
4%  10 mV 
'Initial setting, 
+20° C 
to 
+30°C  (68'F 
to 
86OF). 
'~ny 
500 
hour period after the first 
200 
hours. 
"n 
Store mode. 
6. 
Check Voltages and Waveforms. 
Often the defective 
component can  be located by checking for the correct 
voltage or waveform in the circuit. Refer to the diagrams 
section for voltages and waveforms. 
7. 
Check  Individual  Components. 
The  following 
procedure  describes  methods  of  checking  individual 
components in the 314. Two-lead  components that are 
soldered in place are best checked by first disconnecting 
one end of the component. This isolates the measurement 
from the effects of surrounding circuits. 
CAUTION 
a 
Disconnect the power source  before removing or 
replacing semiconductors  to avoid damage to  the 
device  and  for  protection  from  device  cases 
operated at elevated potentials. 
A good check of transistor operation is actual perfor- 
mance under operating conditions. A transistor  can be 
most effectively checked by substituting a new compo- 
nent or one that has been checked previously. However, 
be  sure  that  circuit  conditions  are  not  such  that  a 
replacement  transistor  might also  be damaged.  If sub- 
stitute transistors are not available, use a dynamic tester. 
A good understanding of circuit operation is desirable 
when  troubleshooting  circuits using integrated circuits. 
Use care when checking voltages and waveforms around 
the 
IC's so that adjacent leads are not short circuited. A 
convenient means of clipping a test probe to dual-in-line 
IC packages in with  an  IC test  clip. This test  clip also 
serves as an extraction 
tool.The lead configuration forthe 
semiconductors used in this insturment are shown in Fig. 
7-2 on a pullout page preceding the diagrams. 
REV. 
A, 
AUG. 
1977