SL869x-V2 Family Product User Guide
1VV0301175 Rev. 9 Page 72 of 93 2021-07-15
Moisture Sensitivity
Precautionary measures are required in handling, storing and using these devices to
avoid damage from moisture absorption. If localized heating is required to rework or
repair the device, precautionary methods are required to avoid exposure to solder reflow
temperatures that can result in performance degradation.
Note: The module is a Moisture Sensitive Device (MSD) Level 3 as
defined by IPC/JEDEC J-STD-020. This rating is assigned due to
some of the components used within the module.
Please follow the MSD and ESD handling instructions on the labels of the MBB and
exterior carton.
The modules are supplied in a hermetically sealed bag with desiccant and humidity
indicator cards. The module must be placed and reflowed within 168 hours of first
opening the hermetic seal provided the factory ambient conditions are < 30°C and < 60%
R. H., and the humidity indicator card indicates less than 10% relative humidity.
If the package has been opened or the humidity indicator card indicates above 10%, then
the parts will need to be baked prior to reflow. The parts may be baked at +90°C ± 5°C for
96 hours.
Note: However, the packaging materials (e.g. tape & reel) can NOT
withstand that temperature. Lower temperature baking is feasible if
the humidity level is low and time is available.
Please refer to IPC/JEDEC J-STD-033 “Handling, Packing, Shipping and Use of
Moisture/Reflow Sensitive Surface Mount Devices” for additional information.
Please refer to the MSL tag affixed to the outside of the hermetically sealed bag.
Note: JEDEC standards are available at no charge from the JEDEC website
https://www.jedec.org
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