All personnel handling ESDS devices have the responsibility to be aware of the ESD threat
to the reliability of electronic products.
Further information can be obtained from the JEDEC standard JESD625-A
“Requirements for Handling Electrostatic Discharge Sensitive (ESDS) Devices”, which
can be downloaded free of charge from:
www.jedec.org
Assembly Considerations
Since the module contains piezo-electric components, it should be placed near the end
of the assembly process to minimize mechanical shock to it.
During board assembly and singulation process steps, pay careful attention to unwanted
vibrations, resonances and mechanical shocks, e.g. those introduced by manufacturing
equipment.
Washing Considerations
After assembly, the module can be washed with de-ionized water using standard PCB
cleaning procedures. The shield does not provide a water seal to the internal components
of the module, so it is important that the module be thoroughly dried prior to use by
blowing excess water and then baking the module to drive residual moisture out.
Depending upon the board cleaning equipment, the drying cycle may not be sufficient to
thoroughly dry the module, so additional steps may need to be taken. Exact process
details will need to be determined by the type of washing equipment as well as other
components on the board to which the module is attached. The module itself can
withstand standard JEDEC baking procedures.
Reflow
The modules are compatible with lead free soldering processes as defined in IPC/JEDEC
J-STD-020. The reflow profile must not exceed the profile given IPC/JEDEC J-STD-020
Table 5-2, “Classification Reflow Profiles”.
Note: Although IPC/JEDEC J-STD-020 allows for three reflows, the
assembly process for the module uses one of those profiles,
therefore the module is limited to two reflows.
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