When re-flowing a dual-sided SMT board, it is important to reflow the side containing the
module last. This prevents heavier components within the module from becoming
dislodged if the solder reaches liquidus temperature while the module is inverted.
Note: JEDEC standards are available free from the JEDEC website
https://www.jedec.org
The recommended reflow profile is shown in the following figure:
Figure 32: Recommended Reflow Profile
Note: Please note that the JEDEC document includes important
information in addition to the above figure. Please refer to:
https://www.jedec.org/sites/default/files/docs/jstd020d-01.pdf
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