WE310G4-I/P Module Hardware User Guide
1VV0301767 Rev. 5 Page 30 of 48 2022-11-08
Not Subject to NDA
It is recommended to bury in inner layers:
1.
Analog or digital audio lines.
2.
Memory address and data bus.
3.
Fast digital signals like SPI or SDIO, clocks, quartz.
4.
USB and long serial.
The following figure shows an example of fast signal track routing. In this example, the
tracks are routed in an inner layer and surrounded by GND and GND vias to be shielded.
If possible, try to shield with GND areas the above and below areas.
Figure 16: Layout Example for FAST Digital Lines
Lines to resolve this, add in parallel, to 10nF, another capacitor of about 10pF to 33pF.
ESD Characteristics
Refer to the table below for the ESD characteristics of the WE310G4-I/P modules.
ESD Voltage
Human Body Model (HBM) ±2000
Charge Device Model ± 500
Table 16: ESD Characteristics
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