WE310G4-I/P Module Hardware User Guide
1VV0301767 Rev. 5 Page 35 of 48 2022-11-08
Not Subject to NDA
9.
PACKAGING
Tray
The WE310G4-I/P modules are packaged on trays of 50 pieces each when small
quantities are required (that is, for test and evaluation purposes).
These trays are not designed for use in SMT processes for pick and place handling.
The following is the packaging process:
Figure 24: WE310G4-I/P Packaging example
Danger: The maximum temperature for these trays shall not exceed 65°C
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