TTControl Vision 307 - Internal Structure; Temperature Sensors; Characteristics; Overheating

7. INTERNAL STRUCTURE

7 Internal structure
This section gives an overview of the internal structure of a Vision 307 device.
7.1 Temperature sensors
To allow monitoring of the internal temperature, the Vision 307 device is equipped with two temperature
sensors. One sensor measures the ambient air temperature within the housing (PCB sensor). The other
sensor is integrated in the i.MX6 CPU to measure the core temperature (on-die sensor).
7.1.1 Characteristics
Symbol Parameter Note Min Max Unit
T
op
Operating temperature measurement range 1 -40 +125
○
C
T
PCB, acy
PCB sensor temperature accuracy
at -55
○
C to 125
○
C
-2.5 +2.5 K
T
on-die, acy
On-die sensor accuracy -7 +7 K
Note 1 Valid for both sensors.
7.1.2 Overheating
The Vision 307 family devices are equipped with a standard thermal protection, implemented by Linux. The
System on a Chip (SoC) temperature is monitored via the on-die sensor, and the device is protected from
overheating by:
• reducing the ARM core clock frequency when SoC temperature reaches 115
○
C
• system shut down when the SoC temperature reaches 120
○
C
NOTE
The user is responsible for monitoring the device temperature, and ensuring that the device does not
overheat. See MRD [2] for further information.
7.2 Speaker
A loudspeaker is mounted within the Vision 307 housing. It is activated via software.
7.2.1 Characteristics
Symbol Parameter Min Max Unit
SPL Sound pressure level, from freely mounted housing
(1 kHz at 0.5 m distance)
80 dBA
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Proprietary Information
32
Document Number:
D-156-G-02-003