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ADLINK Technology arm AMPERE COM-HPC-ALT - User Manual

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Express-ID7 User’s Guide PICMG COM.0 R3.1
Page 1 Copyright © 2023 ADLINK Technology, Inc.
COM-HPC-ALT
Revision: Rev. 0.1
Date: 2023-01-10
Part Number: 50M-00115-1000
Users Guide
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ADLINK Technology arm AMPERE COM-HPC-ALT Specifications

General IconGeneral
Form FactorCOM-HPC
ProcessorAmpere Altra
ArchitectureArm
CPU CoresUp to 80 cores
MemoryUp to 1 TB DDR4
EthernetUp to 2x 10GbE
StorageNVMe
ExpansionPCIe Gen4
USBUSB 3.0, USB 2.0
PCIeUp to 64 PCIe Gen4 lanes
Power Consumption/TDPUp to 175W
Operating Temperature0°C to +60°C

Summary

Revision History

Preface

Disclaimer

Provides legal and liability information regarding the use of ADLINK products and intellectual property.

Environmental Responsibility

Details ADLINK's commitment to environmental preservation and compliance with RoHS and WEEE directives.

Trademarks

Lists product names used for identification purposes and acknowledges registered trademarks.

Safety Instructions

Conventions

Getting Service

Introduction

Specifications

Core System

Details the system-on-chip (SoC) options and their core counts, clock speeds, and TDP.

Expansion Busses

Outlines the various expansion bus interfaces like PCIe, their configurations, and speeds.

Ethernet

Details the Ethernet interfaces, including NBASE-T and KR/KX types, and their capabilities.

Multi I;O and Storage

Covers various input/output interfaces like USB, UART, and GPIO, including their configurations.

Others

Describes additional features such as FAN control and health monitoring, including voltage and temperature monitoring.

Security

Details security-related hardware components like the Trusted Platform Module (TPM).

Module Management Controller (MMC)

Explains the function and connectivity of the Module Management Controller (MMC) for system management.

Debug

Describes the debug connector and its uses for carrier design and module bring-up.

Power

Details the power modes, input voltage requirements, and power management states supported by the module.

Mechanical and Environmental

Specifies the module's physical dimensions, operating temperature, humidity, and environmental testing standards.

Block Diagram

Pinout and Signal Descriptions

Pin Summary

Provides a comprehensive list of all signal pins on the COM-HPC connectors (J1 and J2).

Signal Terminology Descriptions

Defines terms used in signal description tables for clarity and understanding of pin functions.

Signal Descriptions on J1;J2 Connectors

Details the specific signal assignments for various interfaces like Ethernet, USB, PCIe, I2C, and SPI on the J1 and J2 connectors.

Additional Features

Debug Connector (40-pin connector)

Describes the 40-pin debug connector and its critical access points for carrier design.

Status LEDs

Identifies and explains the function of the status LEDs (LED1, LED2, LED3) on the module.

Fan Connector

Details the fan connector type and its pin assignments for fan control.

BIOS Default Reset

Provides step-by-step instructions for performing a hardware reset of BIOS default settings.

BIOS Boot Select

Explains how to configure BIOS boot modes (PICMG vs. Failsafe) using switches.

BIOS Checkpoints, Beep Codes

Status Code Ranges

Lists and describes the status code ranges used for diagnosing boot process issues.

Mechanical and Thermal

Module Dimensions

Shows the physical dimensions of the COM-HPC module in millimeters.

Thermal Solutions

Presents different thermal solutions available for the module, including heatsinks and coolers.

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