Beckhoff CB3064 Series - PCB DIE Center and Outlines

Chapter: Mechanical Drawings PCB: DIE Center
page 114 Beckhoff New Automation Technology CB3064-xxxx
7.3 PCB: DIE Center
Mounting Hole Chip-DIE cooling Electrical isolated cooling required Center Point Cooling Area Dotted Line = Chip outline Solid Line = Cooling Area
1590
1213 609 466
3626
3895
H6: drill 98 mil,Pad 197mil
max. 8W max. 8W
max. 8W
H6
dimension = mil
1080 555 505