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Beckhoff CB3064 Series User Manual

Beckhoff CB3064 Series
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Chapter: Mechanical Drawings PCB: DIE Center
page 114 Beckhoff New Automation Technology CB3064-xxxx
7.3 PCB: DIE Center
Mounting Hole
Chip-DIE cooling
Electrical isolated cooling required
Center Point Cooling Area
Dotted Line = Chip outline
Solid Line = Cooling Area
1590
1213 609 466
3626
3895
H6: drill 98 mil,Pad 197mil
max. 8W
max. 8W
max. 8W
H6
dimension = mil
1080 555 505

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Beckhoff CB3064 Series Specifications

General IconGeneral
BrandBeckhoff
ModelCB3064 Series
CategoryMotherboard
LanguageEnglish