(3) Electrical components
The EOS ELAN 7 E / EOS 30’s electrical system is in the same class as the EOS
A2/A2E/5
’
s, but it has a higher integration with 19 flexible printed circuit boards
(FPC) and 7 hard printed circuit boards (PCB). The major features of the electrical
components are described below. Figure 2-24 shows the electrical components.
● 4-layer/2-layer build-up FPC
This type of FPC enables higher integration than conventional, multi-layer printed
boards.
● BGA packaging of main CPU
A BGA having a fine pitch of 0.8 mm (1.27 mm in the EOS 300/Rebel 2000/EOS
Kiss III) makes the CPU package smaller (12 mm × 12 mm) so that the mounting
surface can be greatly compressed.
● FPC board connector with 0.3mm pitch
Unlike the conventional FPC board whose electrical contacts are 0.5 mm apart, this
connector’s contacts are in a zigzag pattern and 0.3 mm apart. The surface area of
the FPC board's connector is thereby reduced and the connector is smaller.
● External metallic parts connected to GND
The metallic top cover and front cover are connected directly to GND to protect
electronic circuits and to prevent camera misoperation caused by induced noise.
Part 2: Technical Information
2-21
Top flexible board
Eye Control detection IRED
NAC flexible board
Pop end flexible board
Main flexible board
ILC flexible board
ILC-LED
Command Dial contact plate
Command Dial board
Camera orientation detection SW
Camera back flexible board
DX contacts
DX flexible board
Camera back open/close contact plate
BPSW flexible board
Stop-down SW
SI flexible board
TTL flexible board
AF flexible board
Focusing point illumination LED
Quick Control Dial board
M2 motor
MD flexible board
Main capacitor
Remote control jack
Infrared remote
control sensor
Sound element
Shutter release SW
Main Dial board
LCD panel
OLC flexible board
RD flexible board
Dial 2 contact
Dial 1 contact
POPCTR flexible board
Hot shoe
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