Before Installation
IM-ChipEncoder-Series-Rev. 2 Page 6 ©2022 Celera Motion
ChipEncoder Series
Installation Manual and Reference Guide
2.5 Application Notes
The printed circuit board (PCB) land pattern and assembly processes necessary to successfully
integrate the ChipEncoder are detailed as follows:
Use the publication IPC-7351 Generic Requirements for Surface Mount Design and Land
Pattern Standard (developed 2005 by IPC) as a guide for proper land pattern design for the
solder pads on the printed circuit board.
Due to the tight spacing between solder pads, it is recommended that solder mask be used
between the solder pads to prevent solder bridging and shorting to adjacent pads.
A 0.003 - 0.005 inch thick stainless steel stencil is recommended for solder paste
application to the printed circuit board lands.
Machine placement and reflow soldering of the ChipEncoder is recommended.
Acetone is the recommended cleaner for the ChipEncoder.
PCB Requirements
The ChipEncoder electrical interface, land pattern, schematic of additional required passive components
and mechanical dimensions are found in the interface drawings, which are located on the following
webpage: http://www.microesystems.com/resource/product-documentation.
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