Levelflex FMP53
48 Endress+Hauser
Process
Process temperature range
The maximum temperature permitted at the process connection is determined by the O-ring version
ordered:
Device O-ring material Process temperature Approval
FMP53 EPDM (Freudenberg 70 EPDM 291) –20 to +130 °C (–4 to +266 °F) FDA
3A
1)
EHEDG
USP Cl. VI
2)
FFKM (Kalrez 6221) –20 to +150 °C (–4 to +302 °F) FDA
3A
3)
EHEDG
USP Cl. VI
2)
FKM (PPE V70SW) –10 to +150 °C (+10 to +302 °F)
1) Tested according to 3A Sanitary Standard 18-03, Class II
2) Tested according to USP <88> Class VI - 121°C
3) Tested according to 3A Sanitary Standard 18-03, Class I
Process pressure range
Device Process pressure
FMP53 –1 to 16 bar (–14.5 to 232 psi)
The range indicated can be reduced by the choice of process connection. The nominal pressure
(PN) indicated on the nameplate refers to a reference temperature of 20 °C. Observe pressure-
temperature dependency.
Dielectric constant (DC)
Rod probe: DC (ε
r
) ≥ 1.6
To Next Page
Loading...
