Fibocom MG661-EU - Page 5

Contents
2
3.3.8 LCD Interface ........................................................................................... 46
3.3.9 Camera Interface ..................................................................................... 46
3.4 Operating Mode ............................................................................................. 46
3.4.1 Flight Mode .............................................................................................. 47
3.4.2 Sleep Mode .............................................................................................. 48
3.4.3 PSM Mode ............................................................................................... 49
4 RF Interface ................................................................................................... 51
4.1 RF Indicators ................................................................................................. 51
4.2 RF Antenna .................................................................................................... 54
4.2.1 Antenna Introduction ................................................................................ 54
4.2.2 Impedance Design Principles .................................................................. 54
4.2.3 Antenna Passive Test ............................................................................... 57
5 Reliability ....................................................................................................... 60
5.1 Temperature and Humidity Requirements ..................................................... 60
5.2 Reliability Indicators ....................................................................................... 60
5.3 ESD Indicators ............................................................................................... 62
6 Thermal Design ............................................................................................ 63
6.1 Overview ........................................................................................................ 63
6.2 Thermal Basis ................................................................................................ 63
6.3 Thermal Design ............................................................................................. 64
6.3.1 Main Board ............................................................................................... 64
6.3.2 Product Structure ..................................................................................... 65
7 Structure Specifications ............................................................................... 67
7.1 Appearance .................................................................................................... 67
7.2 Dimensions .................................................................................................... 68
8 Packaging and Production .......................................................................... 70
8.1 Packaging ...................................................................................................... 70
8.2 Storage .......................................................................................................... 73
8.3 SMT ............................................................................................................... 73
Appendix A Acronyms and Abbreviations .................................................... 74
Appendix B Reference Standards.................................................................. 76