Foundry Hardware Installation Guide for the FES, FESX, and FWSX
A - 8 © 2008 Foundry Networks, Inc. December 2008
Detailed Procedures
This section describes how to install the hardware and software contents in the Layer 3 upgrade kit.
Hardware Installation
You need a Phillips-head screwdriver and an ESD wrist strap to perform this procedure. You also need a static-
free work area.
To perform the upgrade:
1. Remove the power cable(s) from the device.
WARNING: Disconnect the power cord from all power sources to completely remove power from the device.
2. If the device is mounted in an equipment rack, remove the device from the rack and place the device in a
static-free work area.
3. Put on the supplied ESD wrist strap and attach the clip end to a metal surface (such as an equipment rack) to
act as ground.
4. Disassemble the chassis as follows (refer to Figure A.1 on page A-3):
• Use a Phillips-head screwdriver to remove the two screws in the bottom corners of each side. If rack
mounting ears are installed, remove the four screws that hold each ear to the chassis. See Figure A.1.
• Turn the device so that the front (where the port connectors are) is facing you.
• Slide the cover backwards to free the lip edge of the cover from the front plate. Make sure the cover is
completely free of the front panel.
5. If you are upgrading a FESX model and the device has a 10-Gigabit Ethernet module installed, perform the
following additional steps. Otherwise, go to Step 6.
WARNING: You may need an additional authorized person to help perform the last task in this step and the tasks
in Step 6; one person to hold the 10-Gigabit module while the other installs the DIP key.
• Remove the faceplate located in the upper left-hand corner of the front panel. Use a #2 Phillips-head
screwdriver to remove the two screws that secure the faceplate in place.
• Use a #2 Phillips-head screwdriver to loosen and remove the three screws on the 10-Gigabit module.
• Without disconnecting the cable at the rear of the 10-Gigabit module, gently wriggle the 10-Gigabit
module to dismount it from the main board. Once the board is unfastened, lift it straight up so that you
can access the DIP socket.
6. Remove the DIP key from the package and align the lead pins over the DIP socket at the location listed in
Table A.1 on page 2.
The circular or semicircular indentation on the DIP key indicates the position of lead pin 1. If the DIP key has
a circular indentation, it is aligned with pin 1. The semicircular indentation on the DIP key is located on the
same end as pin 1.
Align the semicircular indentation on the DIP key with the semicircular cut-out on the DIP socket. See the
appropriate illustration:
• “DIP Key Insertion for FES12GCF” on page A-4
Pin 1 Semicircular indentation
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