Fujitsu Primergy RX300 S3 Options Guide

RX300 S3 Options Guide
Contents
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
1.1 Overview of the documentation . . . . . . . . . . . . . . . . . 7
1.2 Options and upgrade . . . . . . . . . . . . . . . . . . . . . 10
1.3 Notational conventions . . . . . . . . . . . . . . . . . . . . 12
2 Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3 Safety notes . . . . . . . . . . . . . . . . . . . . . . . . . . 15
4 Preparation . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
4.1 Removing the server form the rack . . . . . . . . . . . . . . 21
4.2 Opening the server . . . . . . . . . . . . . . . . . . . . . . . 23
5 Main memory . . . . . . . . . . . . . . . . . . . . . . . . . . 25
5.1 Memory module population . . . . . . . . . . . . . . . . . . 25
5.2 Upgrading/replacing the main memory . . . . . . . . . . . . 28
6 Processors . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
6.1 Installing a second processor . . . . . . . . . . . . . . . . . 33
6.2 Replacing the processor . . . . . . . . . . . . . . . . . . . . 38
6.3 Replacing the processor heat sink . . . . . . . . . . . . . . 42
7 ROMB (RAID on Motherboard) . . . . . . . . . . . . . . . . 43
7.1 Installing the ROMB upgrade kit . . . . . . . . . . . . . . . 43

Fujitsu Primergy RX300 S3 Specifications

General

Tcase	78 °C
Bus type	FSB
FSB Parity	Yes
Processor cache	4 MB
Processor cores	2
Processor model	5080
Processor series	Intel Xeon 5000 Series
Processor socket	LGA 771 (Socket J)
Processor threads	4
Processor codename	Dempsey
Motherboard chipset	Intel® 5000P
Processing Die size	162 mm²
Processor frequency	3.73 GHz
Processor cache type	L2
Processor lithography	65 nm
Processor system type	DP
Processor manufacturer	Intel
Processor package size	37.5 x 37.5 mm
Processor front side bus	1066 MHz
Processor operating modes	64-bit
ECC supported by processor	No
Thermal Design Power (TDP)	130 W
Processor core voltage (AC)	1.25 - 1.40 V
CPU multiplier (bus/core ratio)	14
Number of Processing Die Transistors	376 M
Maximum graphics card memory	8 MB
Memory slots	8
Internal memory	2 GB
Internal memory type	DDR2-SDRAM
Maximum internal memory	32 GB
Memory layout (slots x size)	2 x 1 GB
Networking features	Ethernet/Fast Ethernet/Gigabit Ethernet
Expansion slots	1 x PCIe x8, 2 x PCIe x4, 2 x PCI-X
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
Noise level	56 dB
Chassis type	Rack (2U)
Compatible operating systems	Windows Server 2003, Novell SUSE Linux Enterprise Server, Red Hat Enterprise Linux, VMware ESX
I/O ports	8 x SAS
Power supply	600 W
Power requirements	100 - 240V, 50/60 Hz
Operating temperature (T-T)	10 - 35 °C
Safety	IEC 60950-1, EN 60950-1
Electromagnetic compatibility	EN 55 022 A, EN 55024, EN 61000-3-2 / -3-3
RAID levels	1, 5, 10, 50
Processor ARK ID	27213

Weight and Dimensions

Depth	785 mm
Width	483 mm
Height	86 mm
Weight	25000 g