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80-23024 Issue 3r1 HEBER
9.1.5 Why was the enclosure design changed from the original version into V5.x?
We collected all the feedback from first batch users and incorporated this into a number of
changes, both for 3D print manufacturing and to improve quality of life for all Multisystem users.
The V5.x enclosure is stronger and more robust, it uses significantly less support material during
printing and allows easier access with the separate back panel cover rather than a complete top
case section.
9.2 General feedback and contact us
We want to hear any ideas or feedback you have for the Multisystem.
That can include thoughts on the 3D printed enclosure, design usability and general enjoyment of
the system, whatever you want to say, please feel free to get in contact.
You can reach Lillie and Richard @ Heber – e-mail - multisystem@heber.co.uk
If you need support you can visit the RMCretro community Discord chat server at
https://discord.gg/RMCretro - This is community lead casual support with other Multisystem
owners.
If you wish to raise a support request about your Multisystem hardware please email
support@rmcretro.store
Tweet us @MultisystemFPGA Show us your setup and how you are using the Multisystem.
The official MiSTer Forum is also here if you need it – MiSTer FPGA Forum - Index page
(https://misterfpga.org/)
And a big thank you to the wonderful proof readers of this manual and Multisystem website pages.
They all spotted a few blunders and helped make this easier to read and use for everyone else.
Also a special thank you to Chrissy and Neil for all the great feedback and testing on the revisions to
the Multisystem V4/V5 2022 ‘Project Cybertron’ 3D printed enclosure evolution.
We all thank you again for being part of the MiSTer Multisystem, we hope you have fun and enjoy
using it.
Do keep an eye out for expansion cartridges and further modular enhancements for the Multisystem,
we have lots of ideas to make the system even more fun and to allow more connectivity.
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