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Heber MiSTer Multisystem - Printed Enclosure Preparation

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19
80-23024 Issue 3r1 HEBER
6 3D PRINTED ENCLOSURE PREPARATION
The Multisystem motherboard should now be ready for fitting into the 3D printed enclosure or a
case of your own.
To Identify what version of the 3D printed enclosure you own, check on the printed parts, they
should have version numbers as shown below
If you have a Multisystem from 2022 it’s most likely going to be a V5x model or higher.
The original V, V2 & V3 enclosure is shown on the left. Version 5.x (2022) is shown on the right and
below. Initially available in Charcoal Black, Fossil Grey and Cotton White PolyTerra matte PLA.