HP Compaq dc7800 User Manual

Item Description Socket Color
1 DIMM socket XMM1, Channel A Black
2 DIMM socket XMM2, Channel A White
3 DIMM socket XMM3, Channel B White
4 DIMM socket XMM4, Channel B White
NOTE: A DIMM must occupy the black DIMM1 socket. Otherwise, the system
will display a POST error message indicating that a memory module must be
installed in the black socket.
The system will automatically operate in single channel mode, dual channel mode, or flex mode,
depending on how the DIMMs are installed.
●
The system will operate in single channel mode if the DIMM sockets are populated in one channel
only.
●
The system will operate in a higher-performing dual channel mode if the total memory capacity of
the DIMMs in Channel A is equal to the total memory capacity of the DIMMs in Channel B. The
technology and device width can vary between the channels. For example, if Channel A is
populated with two 512-MB DIMMs and Channel B is populated with one 1GB DIMM, the system
will operate in dual channel mode.
●
The system will operate in flex mode if the total memory capacity of the DIMMs in Channel A is not
equal to the total memory capacity of the DIMMs in Channel B. In flex mode, the channel populated
with the least amount of memory describes the total amount of memory assigned to dual channel
and the remainder is assigned to single channel. For optimal speed, the channels should be
balanced so that the largest amount of memory is spread between the two channels. If one channel
will have more memory than the other, the larger amount should be assigned to Channel A. For
example, if you are populating the sockets with one 1-GB DIMM, and three 512-MB DIMMs,
Channel A should be populated with the 1-GB DIMM and one 512-MB DIMM, and Channel B should
be populated with the two 512-MB DIMMs. With this configuration, 2-GB will run as dual channel
and 512-MB will run as single channel.
●
In any mode, the maximum operational speed is determined by the slowest DIMM in the system.
CAUTION: The memory module sockets have gold metal contacts. When upgrading the memory, it
is important to use memory modules with gold metal contacts to prevent corrosion and/or oxidation
resulting from having incompatible metals in contact with each other.
Static electricity can damage the electronic components of the computer or optional cards. Before
beginning these procedures, ensure that you are discharged of static electricity by briefly touching a
grounded metal object. Refer to
Electrostatic Discharge Information on page 53 for more information.
When handling a memory module, be careful not to touch any of the contacts. Doing so may damage
the module.
1. Prepare the computer for disassembly (Preparation for Disassembly on page 60).
2. Remove the computer access panel (
Computer Access Panel on page 64).
WARNING! To reduce risk of personal injury from hot surfaces, allow the internal system
components to cool before touching.
70 Chapter 7 Removal and Replacement Procedures Convertible Minitower (CMT) Chassis

HP Compaq dc7800 Specifications

General

Tcase	73.3 °C
Bus type	FSB
Stepping	M0
Processor cache	2 MB
Processor cores	2
Processor model	E4600
System bus rate	- GT/s
Processor family	Intel® Core™2 Duo
Processor series	Intel Core 2 Duo E4000 Series
Processor socket	LGA 775 (Socket T)
Processor codename	Conroe
Processing Die size	111 mm²
Processor frequency	2.4 GHz
Processor cache type	L2
Processor lithography	65 nm
Processor manufacturer	Intel
Processor front side bus	800 MHz
Processor operating modes	64-bit
ECC supported by processor	No
Thermal Design Power (TDP)	65 W
CPU multiplier (bus/core ratio)	12
Number of Processing Die Transistors	167 M
Internal memory	1 GB
Internal memory type	DDR2-SDRAM
Maximum internal memory	8 GB
Memory layout (slots x size)	2 x 0.5 GB
HDD speed	7200 RPM
HDD interface	SATA
Optical drive type	DVD Super Multi
Total storage capacity	160 GB
Audio input	1
LightScribe	Yes
Networking features	Intel 82566DM Gigabit Network Connection
Graphics card RAMDAC	400 MHz
Storage drive controller	SATA 3, 0 Gb/s NCQ SMART VI
Discrete graphics card model	Intel® GMA 3100
Maximum graphics card memory	0.256 GB
Operating system installed	Windows Vista Business
USB 2.0 ports quantity	8
Chassis type	Mini Tower
Country of origin	China
Cable lock slot type	Kensington
Operating altitude	0 - 3048 m
Non-operating altitude	0 - 9144 m
Storage temperature (T-T)	-30 - 60 °C
Operating temperature (T-T)	10 - 35 °C
Storage relative humidity (H-H)	5 - 95 %
Operating relative humidity (H-H)	10 - 90 %
Power supply	365 W
Product type	PC
Processor code	SLA94
Processor ARK ID	32242
Processor package size	37.5 x 37.5 mm

Weight and Dimensions

Depth	452 mm
Width	177 mm
Height	447 mm
Weight	11800 g