HP Compaq dc7800 User Manual

be populated with the two 512-MB DIMMs. With this configuration, 2-GB will run as dual channel
and 512-MB will run as single channel.
●
In any mode, the maximum operational speed is determined by the slowest DIMM in the system.
Installing DIMMs
CAUTION: You must disconnect the power cord before adding or removing memory modules.
Regardless of the power-on state, voltage is always supplied to the memory modules as long as the
computer is plugged into an active AC outlet. Adding or removing memory modules while voltage is
present may cause irreparable damage to the memory modules or system board.
The memory module sockets have gold-plated metal contacts. When upgrading the memory, it is
important to use memory modules with gold-plated metal contacts to prevent corrosion and/or oxidation
resulting from having incompatible metals in contact with each other.
Static electricity can damage the electronic components of the computer or optional cards. Before
beginning these procedures, ensure that you are discharged of static electricity by briefly touching a
grounded metal object. For more information, refer to
Electrostatic Discharge Information on page 53.
When handling a memory module, be careful not to touch any of the contacts. Doing so may damage
the module.
1. Prepare the computer for disassembly (Preparation for Disassembly on page 107).
2. Remove the access panel (
Computer Access Panel on page 113).
3. Locate the memory module sockets on the system board.
WARNING! To reduce risk of personal injury from hot surfaces, allow the internal system
components to cool before touching.
118 Chapter 8 Removal and Replacement Procedures Small Form Factor (SFF) Chassis

HP Compaq dc7800 Specifications

General

Tcase	73.3 °C
Bus type	FSB
Stepping	M0
Processor cache	2 MB
Processor cores	2
Processor model	E4600
System bus rate	- GT/s
Processor family	Intel® Core™2 Duo
Processor series	Intel Core 2 Duo E4000 Series
Processor socket	LGA 775 (Socket T)
Processor codename	Conroe
Processing Die size	111 mm²
Processor frequency	2.4 GHz
Processor cache type	L2
Processor lithography	65 nm
Processor manufacturer	Intel
Processor front side bus	800 MHz
Processor operating modes	64-bit
ECC supported by processor	No
Thermal Design Power (TDP)	65 W
CPU multiplier (bus/core ratio)	12
Number of Processing Die Transistors	167 M
Internal memory	1 GB
Internal memory type	DDR2-SDRAM
Maximum internal memory	8 GB
Memory layout (slots x size)	2 x 0.5 GB
HDD speed	7200 RPM
HDD interface	SATA
Optical drive type	DVD Super Multi
Total storage capacity	160 GB
Audio input	1
LightScribe	Yes
Networking features	Intel 82566DM Gigabit Network Connection
Graphics card RAMDAC	400 MHz
Storage drive controller	SATA 3, 0 Gb/s NCQ SMART VI
Discrete graphics card model	Intel® GMA 3100
Maximum graphics card memory	0.256 GB
Operating system installed	Windows Vista Business
USB 2.0 ports quantity	8
Chassis type	Mini Tower
Country of origin	China
Cable lock slot type	Kensington
Operating altitude	0 - 3048 m
Non-operating altitude	0 - 9144 m
Storage temperature (T-T)	-30 - 60 °C
Operating temperature (T-T)	10 - 35 °C
Storage relative humidity (H-H)	5 - 95 %
Operating relative humidity (H-H)	10 - 90 %
Power supply	365 W
Product type	PC
Processor code	SLA94
Processor ARK ID	32242
Processor package size	37.5 x 37.5 mm

Weight and Dimensions

Depth	452 mm
Width	177 mm
Height	447 mm
Weight	11800 g