NOTE: Steps 2 through 4 apply to tablet models equipped with a graphics subsystem with discrete
memory. See steps 5 through 7 for fan/heat sink assembly information for tablet models equipped with a
graphics subsystem with UMA memory.
2. Disconnect the fan cables (1) from the system board.
3. Loosen the six Phillips captive screws (2) that secure the fan/heat sink assembly to the system board.
4. Remove the fan/heat sink assembly (3).
NOTE: Steps 5 through 7 apply to tablet models equipped with a graphics subsystem with UMA memory.
See steps 2 through 4 for fan/heat sink assembly information for tablet models equipped with a graphics
subsystem with discrete memory.
5. Disconnect the fan cable (1) from the system board.
6. Loosen the four Phillips captive screws (2) that secure the fan/heat sink assembly to the system board.
7. Remove the fan/heat sink assembly (3).
NOTE: The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink assembly and
the system board components each time the heat sink is removed. Replacement thermal material is included
with the fan/heat sink assembly and system board spare part kits.
Tablet models with a graphics subsystem with discrete memory: Thermal paste is used on the processor (1) and
the heat sink section (2) that services it. Thermal paste is also used on the VGA component (3) and the heat sink
section (4) that services it.
Component replacement procedures 51
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