Huawei SE2900 - Page 60

HUAWEI SE2900 Session Border Controller
Hardware Description
1 Service Processing Device
Issue 01 (2016-01-15)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
56
No.
Compone
nt
Quantity
Description
provides system interfaces, General Purpose
Input/Output (GPIO), serial ports, and
Inter-Integrated Circuit (I2C) bus.
2
Encryption
and
decryption
daughter
board
1
This board performs data encryption and
decryption.
3
CPU
2
Intel
®
Xeon
®
full-power, 8-core Sandy Bridge-EP
CPU
4
Heat sink
1
The heat sink is used to cool CPUs. Two CPUs
share one heat sink.
5
Cover
1
The metal cover is used to protect the components
on the board and guide air flows.
6
RDIMM
6
Six 16 GB RDIMMs are used to provide 96 GB
memory.
NOTE
The RDIMMs are installed close to the CPUs. The six
RDIMMs are installed in sockets J45, J46, J47, J48, J7
and J8, as shown in Figure 1-41.
7
Solid-state
drive (SSD)
1
The SSD stores the operating system (OS) and field
programmable gate array (FPGA) files.
Figure 1-42 shows the board panel.
Figure 1-42 Panel
1. SFP+ ports
2. Optical port indicators
3. SFP ports
4. UID indicator
5. HLY indicator
6. Ejector levers
7. OFL indicator/button
-