Huawei SE2900 - Page 68

HUAWEI SE2900 Session Border Controller
Hardware Description
1 Service Processing Device
Issue 01 (2016-01-15)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
64
No.
Compone
nt
Quantity
Description
provides system interfaces, General Purpose
Input/Output (GPIO), serial ports, and
Inter-Integrated Circuit (I2C) bus.
2
CPU
1
The board uses one Intel
®
Xeon
®
full-power, 8-core
Sandy Bridge-EP CPU.
3
Heat sink
1
The heat sink is used to cool the CPU.
4
Cover
1
The metal cover is used to protect the components
on the board and guide air flows.
5
RDIMM
3
Three 16 GB RDIMMs are used to provide 48 GB
memory.
NOTE
The RDIMMs are installed close to CPU0. The three
RDIMMs are installed in sockets J45, J46, and J7, as
shown in Figure 1-47.
6
Solid-state
drive (SSD)
1
The SSD stores the operating system (OS) and field
programmable gate array (FPGA) files.
Figure 1-48 shows the board panel.
Figure 1-48 Panel
1. SFP+ ports
2. Optical port indicators
3. SFP ports
4. UID indicator
5. HLY indicator
6. Ejector levers
7. OFL indicator/button
-
Interfaces
Figure 1-49 shows the panel ports on the board. Table 1-42 describes the panel ports.