Huawei SE2900 - Page 72

HUAWEI SE2900 Session Border Controller
Hardware Description
1 Service Processing Device
Issue 01 (2016-01-15)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
68

The processing module forwards service data and implements data encryption and
decryption.

The EF module on the backplane side provides the Update , Base, and Fabric channels to
communicate with the switch modules.

The BMC module implements board management and interacts with the backplane
through the CAN bus.

The power module supplies power to the function modules of the board.
Hardware and Software Compatibility
Table 1-44 lists hardware and software compatibility of the SPUZ0.
Table 1-44 Hardware and software compatibility
Board Model
Spare Parts Model
Compatibility Rule
SPUZ0
SPUZ0
Only a board of the same
model can be used to
replace the SPUZ0 board.
You do not need to
manually upgrade software.
Technical Specifications
Table 1-45 lists the technical specifications of the SPUZ0.
Table 1-45 Technical specifications
Item
Specifications
Mechanical
specifications
Dimensions (H x
W x D)
45.2 mm x 205.0 mm x 531.0 mm (1.78 in. x 8.07
in. x 20.91 in.)
Weight
5.0 kg (11.03 lb)
Electrical
specifications
Maximum
power
consumption
190 W
Typical power
consumption
175 W
Power supply
Two -48 V DC power supplies (provided by the
backplane)
Environmental
specifications
Temperature

Long-term operating temperature: 0°C to 45°C
(32°F to 113°F)

Short-term operating temperature: -5°C to
+55°C (23°F to 131°F)

Storage temperature: -40°C to +70°C (-40°F to
+158°F)

Temperature change rate: 15°C/h (27°F/h)