Huawei SE2900 - Page 84

HUAWEI SE2900 Session Border Controller
Hardware Description
1 Service Processing Device
Issue 01 (2016-01-15)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
80
No.
Compone
nt
Quantity
Description
4
CPU
1
The board uses one Intel
®
Xeon
®
full-power, 6-core
Ivy Bridge-EN CPU.
5
Heat sink
1
The heat sink is used to cool the CPU.
6
Cover
1
The metal cover is used to protect the components
on the board and guide air flows.
7
Memory
2
Two 16 GB RDIMMs are used to provide 32 GB
memory.
Figure 1-60 shows the board panel.
Figure 1-60 Panel
1. SFP+ optical port
2. Optical port indicators
3. SFP port
4. UID indicator
5. HLY indicator
6. Ejector levers
7. OFL indicator/button
8. SFP port
9. SFP+ optical port
Interfaces
Figure 1-61 shows the panel ports on the board. Table 1-54 describes the panel ports.