Mechanical Drawings
104 Thermal and Mechanical Design Guidelines
Figure 58. ATX/µATX Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling Components -
Sheet 1
B
C
D
A
123
4
5678
47.50
47.50
2
0.00
2
0.00
39.01
21.00
20.00
28.00
36.78
41.00
36.00
31.51
23.00
15.50
15.50
23.00
31.51
31.51
36.78
45.26
31.96
45.26
19.32
19.32
47.50
45.26
36.49
27.00
36.78
23.47
23.47
36.78
45.26
40.00
27.81
32.51
27.51
32.51
27.51
47.50
4X
4.03
36.00
36.00
24.51
6.15
5.90
7.30
7.05
13.00
2.20
33.00
44.00
40.00
39.01
39.01
39.01
36.00
36.00
()17.44
PIN 1
()16.965
()1.17
()1.09
()1.93
()2.80
()1.09
()1.17
4X 6.00
()37.50
()37.50
()95.00
()72.00
()95.00
()72.00
()
0.965
()
0.570
()16.00
()16.87
()20.00
()19.13
LEGEND
SOCKET/THERMO/MECHANICAL COMPONENT KEEP-INS
10.0 MM MAX COMPONENT HEIGHT
2.5 MM MAX COMPONENT HEIGHT
6.0 MM MAX COMPONENT HEIGHT
25.0 MM MAX COMPONENT HEIGHT
1.8 MM MAX COMPONENT HEIGHT
BOARD ROUTING KEEP-OUT
SHEET 1 OF 3
DO NOT SCALE DRAWING
SCALE: NONE
3
C40819
D
REVDRAWING NUMBERCAGE CODE
SIZE
LGA775 microATX
COMPONENT KEEP-INS
TITLE
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
CORP.
R
DEPARTMENT
N/A
FINISH:
N/A
MATERIAL:
DATEAPPROVED BY
DATEAPPROVED BY
DATECHECKED BY
DATEDESIGNED BY
U NLESS O THERWI SE SPECIFIED
INTERPRET DIMENSIO NS AND TOLERANCES
IN ACCORDANCE WITH ASME Y14.5M-1994
DIMENSIONS ARE IN MILLIMETERS
THIRD ANGLE PROJECTION
REVISION HISTORY
ZONE REV DESCRIPTION DATE APPROVED
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2 GEOMETRIC CENTER OF CPU PACKAGE / SOCKET HOUSING CAVITY.
3. BOARD COMPONENET KEEP-INS AND MECHANICAL COMPONENET KEEP-OUTS
TO BE UTILIZED WITH SUFFICIENT ALLOWANCES FOR PLACEMENT AND SIZE TOLERANCES,
ASSEMBLY PROCESS ACCESS, AND DYNAMIC EXCURSIONS.
4. ASSUME SYMMETRY FOR UNDIMENSIONED CORNERS AND EDGES.
DETAIL A
BOARD PRIMARY SIDE
PACKAGE
BOUNDARY
SOCKET BALL 1
SOCKET VOL
OUTLINE
SEE DETAIL
A
SOCKET BALLS
PACKAGE LANDS
SOCKET BALL 1
SOCKET HOUSING
CAVITY
PACKAGE BOUNDARY
PIN 1
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