5G Module Series
RM500Q-AE&RM502Q-AE Hardware Design
RM500Q-AE&RM502Q-AE_Hardware_Design 67 / 83
6.3. I/O Requirements
Table 33: I/O Requirements
1.
1)
To meet this operating temperature range, you need to ensure effective thermal dissipation, for
example, by adding passive or active heatsinks, heat pipes, vapor chambers, etc. Within this range,
the module meets 3GPP specifications.
2.
2)
To meet this extended temperature range, you need to ensure effective thermal dissipation, for
example, by adding passive or active heatsinks, heat pipes, vapor chambers, etc. Within this range,
the module remains the ability to establish and maintain functions such as voice, SMS, emergency
call, etc., without any unrecoverable malfunction. Radio spectrum and radio network are not