74 Rockwell Automation Publication 2198-UM001D-EN-P - May 2014
Chapter 5 Connecting the Kinetix 5500 Drive System
Ground Multiple Subpanels
In this figure, the chassis ground is extended to multiple subpanels.
Figure 40 - Subpanels Connected to a Single Ground Point
High-frequency (HF) bonding is not illustrated. For HF bonding information,
refer to Bonding Multiple Subpanels
on page 38.
Follow NEC and applicable
local codes.
Bonded Ground Bus
Ground Grid or Power
Distribution Ground
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