Siemens SENTRON PAC RS485 User Manual

PAC RS485
Manual, 02/2008, A5E02091800B-01
3
Table of contents
1 Introduction................................................................................................................................................ 7
1.1 Purpose of this document ..............................................................................................................7
1.2 Orientation aids..............................................................................................................................7
1.3 Scope of supply .............................................................................................................................8
1.4 Contents of the CD for the SENTRON PAC Power Monitoring Device.........................................8
1.5 Technical support...........................................................................................................................9
1.6 Further documentation.................................................................................................................10
2 Safety notes............................................................................................................................................. 11
2.1 Safety notes .................................................................................................................................11
3 Description............................................................................................................................................... 13
3.1 Area of application .......................................................................................................................13
3.2 Features.......................................................................................................................................13
3.3 Tasks............................................................................................................................................14
3.4 Structure.......................................................................................................................................15
3.5 Firmware ......................................................................................................................................16
3.6 Bus and master............................................................................................................................17
4 Assembling.............................................................................................................................................. 19
4.1 Procedure for installation and commissioning .............................................................................19
4.2 Unpacking ....................................................................................................................................20
4.3 Assembly......................................................................................................................................21
4.4 Connecting...................................................................................................................................23
4.5 Measures to be performed prior to start-up .................................................................................26
4.6 Disassembly.................................................................................................................................27
5 Parameter assignment/Addressing.......................................................................................................... 29
5.1 MODBUS RTU.............................................................................................................................29
5.1.1 Structure of the job message frame.............................................................................................29
5.1.2 Character frame ...........................................................................................................................30
5.1.3 Function codes.............................................................................................................................31
5.1.4 Exception codes...........................................................................................................................33
5.1.5 Modbus measured variables with the function codes 0x03 an
d 0x04 .........................................33
5.1.6
Structure.......................................................................................................................................38
5.1.6.1 Structure - Digital input status and digital output status with the function codes 0x03 and
0x04 .............................................................................................................................................38
5.1.6.2 Structure - Device diagnostics and device status with the function codes 0x03 and 0x04 .........38
5.1.6.3 Structure - Limit values with function codes 0x03 and 0x04........................................................39
5.1.7 Modbus status parameters with the function code 0x02 .............................................................39
5.1.8 Modbus settings with the function codes 0x03, 0x04 and 0x10 ..................................................40

Siemens SENTRON PAC RS485 Specifications

General

Communication Interface	RS485
Protocol	Modbus RTU
Display	LCD
Mounting	DIN Rail
Device Type	Power Monitoring Device
Series	SENTRON PAC
Operating Temperature	-10 °C to +55 °C
Storage Temperature	-25 °C to +70 °C
Relative Humidity	5 % to 95 % (non-condensing)
Weight	Approx. 0.3 kg
Frequency Measurement Range	45 Hz to 65 Hz
Protection Class	IP20