Siemens SINAMICS G120P - Figure 4-7 Grounding and High-Frequency Equipotential Bonding Measures in the Drive System and in the Plant

Connecting
4.9 EMC guidelines
Power Module PM230 IP55
54 Hardware Installation Manual, 2010-07-02, A5E02923635A AB
Grounding and high-frequency equipotential bonding measures
The following figure illustrates all grounding and high-frequency equipotential bonding
measures using an example with a SINAMICS G120P.
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Figure 4-7 Grounding and high-frequency equipotential bonding measures in the drive system and
in the plant
The ground connections ① represent the conventional grounding system for the drive
components. They are made with standard, heavy-power PE conductors without special
high-frequency properties and ensure low frequency equipotential bonding as well as
protection against injury.
The line supply cable of the inverter can be unshielded. The inverter has to be grounded by
this cable.
The shielded motor cable provides high-frequency equipotential bonding between the
inverter and the motor terminal box. The shield of the motor cable has to be connected to the
EMC shield busbar
③ in the inverter by the integrated shield clips with a large contact area.
On the motor side the shield has to be connected to the terminal box via an electrically
conductive PG gland
④.