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SIM5300E_Hardware_Design_V1.02

Mandatory bake before use. After bake, it must be reflowed within the time limit specified on the

label.

Notes:

1. If the vacuum package is not open for 6 months or longer than the packing date, baking is also

recommended before re-flow soldering.

2. Product handling, storage and processing must follow IPC / JEDEC J-STD-033.

6.3 BAKING REQUIREMENTS

Because of its sensitivity to moisture absorption, SIM5300E should be baked sufficiently before re-flow

soldering. Otherwise SIM5300E will be at the risk of permanent damage during re-flow soldering. SIM5300E

should be baked 192 hours at temperature 40°C +5°C /-0°C and <5% RH for low-temperature device

containers, or 72 hours at temperature 80°C ±5°C for high-temperature device containers. When baking

SIM5300E modules, note that the plastic tray is not heat resistant. Otherwise the tray may be damaged by

high-temperature during baking.

Table 34: Baking requirements

Baking temperature

Moisture

Time

40°C ±5°C

<5%

192 hours

120°C ±5°C

<5%

4 hours

7 PACKAGING

SIM5300E module support tray packaging.

SimCom SIM5300E Hardware Design

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