Sony HBD-E280 - Safety Information and Precautions; Laser Safety Compliance; Service Safety Checks; Component Handling Precautions

HBD-E280/T28
2
SAFETY CHECK-OUT
After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’ instructions to use these
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The “limit” indication
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2 V AC range are suitable. (See
Fig. A)
1.5 kΩ0.15 μF
AC
voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Earth Ground
Fig. A. Using an AC voltmeter to check AC leakage.
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONC-
TIONNEMENT. NE REMPLACER CES COMPOSANTS QUE
PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DON-
NÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
• This system incorporates with Dolby* Digital and Dolby Pro Logic (II) adaptive matrix surround
decoder and the DTS** Digital Surround System.
* Manufactured under license from Dolby Laboratories.
Dolby, Pro Logic, and the double-D symbol are trademarks of Dolby Laboratories.
** Manufactured under license under U.S. Patent #’s:
5,451,942; 5,956,674; 5,974,380; 5,978,762; 6,226,616; 6,487,535; 7,212,872; 7,333,929;
7,392,195; 7,272,567 & other U.S. and worldwide patents issued & pending.
DTS, DTS-HD and the Symbol are registered trademarks, & DTS-HD Master Audio, and
the DTS logos are trademarks of DTS, Inc. Product includes software. © DTS, Inc. All
Rights Reserved.
• This system incorporates High-Defi nition Multimedia Interface (HDMI™) technology.
HDMI, the HDMI logo and High-Defi nition Multimedia Interface are trademarks or registered
trademarks of HDMI Licensing LLC in the United States and other countries.
• Java is a trademark of Oracle and/or its affi liates.
• “BD-LIVE” and “BONUSVIEW” are trademarks of Blu-ray Disc Association.
• “Blu-ray Disc” is a trademark.
• “Blu-ray Disc,” “DVD+RW,” “DVD-RW,” “DVD+R,” “DVD-R,” “DVD VIDEO,” and “CD”
logos are trademarks.
• “Blu-ray 3D” and “Blu-ray 3D” logo are trademarks of Blu-ray Disc Association.
• “BRAVIA” is a trademark of Sony Corporation.
• “AVCHD” and the “AVCHD” logo are trademarks of Panasonic Corporation and Sony Corpora-
tion.
•
, “XMB,” and “xross media bar” are trademarks of Sony Corporation and Sony Computer
Entertainment Inc.
• “PLAYSTATION” is a trademark of Sony Computer Entertainment Inc.
• The Wi-Fi CERTIFIED™ Logo is a certifi cation mark of the Wi-Fi Alliance.
• The Wi-Fi Protected Setup™ Mark is a mark of the Wi-Fi Alliance.
• “Wi-Fi CERTIFIED™” and “Wi-Fi Protected Setup™” are trademarks of the Wi-Fi Alliance.
• “PhotoTV HD” and the “PhotoTV HD” logo are trademarks of Sony Corporation.
• MPEG Layer-3 audio coding technology and patents licensed from Fraunhofer IIS and Thom-
son.
• iPhone, iPod, iPod classic, iPod nano, and iPod touch are trademarks of Apple Inc., registered in
the U.S. and other countries.
• “Made for iPod,” and “Made for iPhone” mean that an electronic accessory has been designed
to connect specifi cally to iPod or iPhone, respectively, and has been certifi ed by the developer
to meet Apple performance standards. Apple is not responsible for the operation of this device
or its compliance with safety and regulatory standards. Please note that the use of this accessory
with iPod or iPhone may affect wireless performance.
• Windows Media is either a registered trademark or trademark of Microsoft Corporation in the
United States and/or other countries.
This product contains technology subject to certain intellectual property rights of Microsoft.
Use or distribution of this technology outside of this product is prohibited without the appro-
priate license(s) from Microsoft. Content owners use Microsoft PlayReady™ content access
technology to protect their intellectual property, including copyrighted content. This device
uses PlayReady technology to access PlayReady-protected content and/or WMDRMprotected
content. If the device fails to properly enforce restrictions on content usage, content owners
may require Microsoft to revoke the device’s ability to consume PlayReady-protected content.
Revocation should not affect unprotected content or content protected by other content access
technologies. Content owners may require you to upgrade PlayReady to access their content. If
you decline an upgrade, you will not be able to access content that requires the upgrade.
• All other trademarks are trademarks of their respective owners.
• Other system and product names are generally trademarks or registered trademarks of the manu-
facturers. ™ and ® marks are not indicated in this document.
NOTES ON CHIP COMPONENT REPLACEMENT
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
• Keep the temperature of soldering iron around 270 °C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
This appliance is classified as a
CLASS 3R LASER product.
Visible and invisible laser radiation
is emitted when the laser protective
housing is opened, so be sure to
avoid direct eye exposure.
This marking is located on the laser
protective housing inside the
enclosure.
This appliance is classified as a
CLASS 1 LASER product. This
marking is located on the rear
exterior.