Bosch Sensortec"| BST-BMP581-DS004-02 70 | 74
Modifications reserved | Data subject to change
without notice Document number: BST-BMP581-DS004-02
8.4 Moisture Sensitivity Level and Soldering
8.4.1 MSL and device storage
The BMP581 is classified as MSL 1 (moisture sensitivity level) according to IPC/JEDEC standards J-STD-020E and
JSTD-033D.
To ensure good solder-ability, the devices shall be stored at room temperature (20°C) before.
The soldering process can lead to an offset shift. The physical origin of this shift is not material aging but mechanical
hysteresis frozen in by the soldering temperature cycle. Thus the shift is reversible.
Multiple reflow cycles will not add up in multiple offset shifts. The device is in the same condition after every solder
reflow cycle.
Manual unsoldering can lead to further offset shift, especially if the soldering temperature and / or soldering time is
above the given values of 260°C and 40 sec.
Avoid contact of the device with liquids or small particles.
8.4.2 Reflow Solder profile
The device has been tested for soldering according to J-STD-002E with Pb-free soldering. The minimum height of the
solder after reflow shall be at least 25µm. This is required for a good mechanical decoupling between sensor device
and the printed circuit board (PCB). When designing the solder paste silk print opening window, avoid excess solder
paste to allow good reflow.
The device has been tested for a total of up to 3 reflow soldering cycles.
This could be a situation where a PCB is mounted with devices from both sides (i.e. 2 reflow cycles necessary) and
where in the next step an additional re-work cycle could be required (1 reflow).
8.5 Environmental Safety
8.5.1 RoHS
The BMP581 sensor meets the requirements of the EC restriction of hazardous substances (RoHS) directive, see
also: Directive 2015/863 (amending Annex II to Directive 2011/65/EU) of the European Parliament and of the Council
on the restriction of the use of certain hazardous substances in electrical and electronic equipment.
8.5.2 Halogen content
The BMP581 is halogen-free. For more details on the analysis results please contact your Bosch Sensortec
representative.
8.6 Internal Package Structure
Within the scope of Bosch Sensortec's ambition to improve its products and secure the mass product supply, Bosch
Sensortec qualifies additional sources (e.g. 2nd source) for the LGA package of the BMP581.
While Bosch Sensortec took care that all of the technical packages parameters are described above are 100%
identical for all sources, there can be differences in the chemical content and the internal structural between the
different package sources.
However, as secured by the extensive product qualification process of Bosch Sensortec, this has no impact to the
usage or to the quality of the BMP581 product.
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