Bosch BMP581 - Table 29: Package Markings; Table 30: Package Marking Details; Table 31: Marking of Engineering Samples

Bosch Sensortec"| BST-BMP581-DS004-02 69 | 74
Modifications reserved | Data subject to change
without notice Document number: BST-BMP581-DS004-02
8.3 Device Marking
The BMP581 device lid shows the following laser-marking:
8.3.1 Mass Production Devices
Table 29: Package markings
Marking
Name
Symbol
Description
Product number
A
1 digit (alphanumeric), fixed; for identification
of device type (“A” = BMP581)
Date Code
n/a
no date code
Supply Chain ID
C or P
1 digit (alphanumeric), fixed; For identification
of supplier and location
Lot Counter (Trace Code)
XXX
3 digits (alphanumeric 0–Z), variable, no reset;
36³ = 46656 sublots/supplier/device type
Table 30: Package marking details
Parameter
Description/Value
Method
--
Laser
Font Type
--
OCR-A
Marking Zone
MZ
Flat surface of metal lid
Stroke Width
SW
0.075 mm +/- 0.010 mm
Pin1 Diameter
PD
0.200 mm +/- 0.015 mm
Character Height
CH
0.325 mm +/- 0.010 mm
Character Width
CW
0.220 mm +/- 0.012 mm
Character Spacing
CS
min. 0.025 mm
Line Spacing
LS
min. 0.076 mm
Marking Depth
--
3–10 µm
8.3.2 Engineering Samples
Table 31: Marking of engineering samples
Position
Name
Symbol
Remark
Upper Line
Eng. Sample ID
CE or
PE
Packaging house ID
Lower Line left
Major revision
ID
F, A, or
C
single alphanumeric digit
Lower Line middle
Minor revision
ID
0,1,2...
single numeric digit
Lower Line right
Sublot ID
A,B,C,...
single alphanumeric digit
Corner of pin 1
Pin 1
Orientation
Marker
Solid circle with diameter of 200 μm