ELECTROSTATIC DISCHARGE (ESD)
Curtis products. Like most modern electronic devices, contain ESD-sensitive components, and it
is therefore necessary to protect them from ESD (electrostatic discharge) damage. Most of the
product's signal connections have protection for moderate ESD events, but must be protected
from damage if higher levels exist in a particular application.
ESD immunity is achieved either by providing sufficient distance between conductors and the
ESD source so that a discharge will not occur, or by providing an intentional path for the
discharge current such that the circuit is isolated from the electric and magnetic fields produced
by the discharge. In general the guidelines presented above for increasing radiated immunity
will also provide increased ESD immunity.
It is usually easier to prevent the discharge from occurring than to divert the current path. A
fundamental technique for ESD prevention is to provide adequately thick insulation between all
metal conductors and the outside environment so that the voltage gradient does not exceed the
threshold required for a discharge to occur. If the current diversion approach is used, all exposed
metal components must be grounded. The shielded enclosure, if properly grounded, can be used
to divert the discharge current; it should be noted that the location of holes and seams can have a
significant impact on ESD suppression. If the enclosure is not grounded, the path of the
discharge current becomes more complex and less predictable, especially if holes and seams are
involved. Some experimentation may be required to optimize the selection and placement of
holes, wires, and grounding paths. Careful attention must be paid to the control panel design so
that it can tolerate a static discharge. MOV, transorbs, or other devices can be placed between B-
and offending wires, plates, and touch points if ESD shock cannot be otherwise avoided.
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