Dell EMC XC Core XC6515 - Thermal Restriction Matrix; Gaseous Contamination Specifications; Thermal Restriction Matrix for Processor and Fans

Table 81. Particulate contamination specifications (continued)
Particulate contamination Specifications
NOTE: Air filtering can also be accomplished by filtering
room air with MERV8 filter per ANSI/ASHARE Standard
127.
Conductive dust Air must be free of conductive dust, zinc whiskers, or other
conductive particles.
NOTE: This condition applies to data center and non-
data center environments.
NOTE: Common sources of conductive dust include
manufacturing processes, and zinc whiskers from the
plating on the bottom of raised floor tiles.
Corrosive dust • Air must be free of corrosive dust.
• Residual dust present in the air must have a deliquescent point
less than 60% relative humidity.
NOTE: This condition applies to data center and non-
data center environments.
Table 82. Gaseous contamination specifications
Gaseous contamination Specifications
Copper Coupon Corrosion rate <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013
Silver Coupon Corrosion rate <200 Å/month as defined by ANSI/ISA71.04-2013
NOTE: Maximum corrosive contaminant levels measured at ≤50% relative humidity.
Thermal restriction matrix
Table 83. Thermal restriction matrix for processor and fans
Configuration 8 x 2.5-inch
Processor TDP Processor cTDP Max
120 W 150 W STD fan
STD heat sink
155 W 180 W STD fan
STD heat sink
180 W 200 W STD fan
HPR heat sink
200 W 200 W STD fan
HPR heat sink
225 W 240 W HPR fan
HPR heat sink
280 W 280 W HPR fan
HPR HSK with DIMM Blank
Technical specifications 141