NOTE: To ensure proper cooling in the system with 280 W processor, memory module blank should be installed in the
memory sockets that are not populated.
NOTE: For 280 W processor, maximum supported ambient temperature is 30°C.
NOTE: For 10 x 2.5-inch drives (NVMe), maximum supported ambient temperature is 30°C.
Table 84. Thermal restriction matrix for T4 GPGPU
Riser configurations Configuration type and ambient temperature support
8 x 2.5-inch drives
2 LP
Ambient = 30°C
Slot 2 HPR fan
Slot 3 HPR fan
Table 85. Label reference
Label Description
STD Standard
HPR High performance
HSK Heat sink
LP Low profile
Thermal restriction for ASHRAE A3/Fresh air environment
NOTE: XC Core XC6515 does not support.
• Processor TDP equal or greater than 180 W are not supported.
• 128 GB or greater capacity LRDIMMs are not supported.
• Redundant power supply configuration is required, but PSU failure is not supported
• Non-Dell qualified peripheral cards greater than 25 W are not supported.
• GPU card is not supported.
• PCIe SSD is not supported.
Other thermal restrictions
1. SolarFlare, Mellanox CX4/CX5/CX6, P4800 AIC can only support up to 35°C ambient.
2. Mellanox CX6 on 10x2.5-inch configuration can only support on slot 3.
3. 25G OCP card does not support with 128 GB LRDIMM on 10 x 2.5-inch configuration.
4. HPR fan is required with 128 GB LRDIMM.
5. T4 GPGPU is not supported with 128 GB LRDIMM.
6. T4 GPGPU supports up to 30°C ambient temperature with HPR fans and 4 x 3.5-inch or 8 x 2.5-inch configurations.
7. T4 GPGPU supports up to 30°C ambient temperature with HPR fan and 10 x 2.5-inch configuration (NVMe(slot 6-9) and SAS or
SATA drives (slot 0-5)) on slot 3 only.
142
Technical specifications
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