ABOUT THIS MANUAL
................................................................3
What you can do with this manual
...........................................3
Using Adobe Reader (Windows version)
...................................4
SAFETY PRECAUTIONS
...............................................................6
NOTE FOR SCHEMATIC DIAGRAM
..............................................7
NOTE FOR PARTS LIST
................................................................7
TECHNICAL SPECIFICATIONS
.....................................................9
DIMENSION
..............................................................................10
CAUTION IN SERVICING
...........................................................11
Initializing This Unit
................................................................. 11
Support for Asia-Pacic tropical climate regions
f
................ 11
DISASSEMBLY
..........................................................................12
1. LOADER PANEL ASSY
.........................................................14
2. FRONT PANEL ASSY
............................................................14
3. CD MECHA ASSY
................................................................15
4. HEAT SINK SUB ASSY
..........................................................15
5. POWER and CONNECT PCB
................................................16
6. MCU PCB
............................................................................16
7. SPEAKER PCB
......................................................................16
8. TRANS
................................................................................16
NOTES ON HANDLING AND REPLACEMENT OF THE LASER PICK-
UP
.............................................................................................17
1. Protection of the LD
...........................................................17
2. Precautions when handling the laser CD mechanism
.......17
3. Cautions on assembling and adjustment
..........................17
4. Determining whether the laser pick-up is defective
..........17
SPECIAL MODE
.........................................................................18
Special mode setting button
..................................................18
1. Version Display Mode
........................................................19
2. Display check mode
...........................................................19
3. Initialization (cold start)
.....................................................19
4. CD test mode
.....................................................................20
5. CD Heat run mode
.............................................................23
6. Accumulated laser on time display mode
..........................25
7. Updating MAIN u-COM
......................................................25
8. Protection History Display Mode
.......................................26
VERSION DISPLAY OF DAB MODULE (RCD-M40DAB only)
g
.27
PROCEDURE AFTER REPLACING THE MICROPROCESSOR, ETC.
28
FIRMWARE UPDATE PROCEDURE
............................................29
1. Updating via USB
...............................................................29
TROUBLE SHOOTING
................................................................32
1. VFD is not lit
.......................................................................32
2. No sound or noise is output
...............................................33
MEASURING METHOD AND WAVEFORMS
...............................38
1. DIGITAL PCB test point
.......................................................38
2. INPUT PCB test point
.........................................................39
3. WAVEFORMS
......................................................................40
LEVEL DIAGRAM
.......................................................................43
BLOCK DIAGRAM
.....................................................................44
POWER DIAGRAM
....................................................................45
WIRING DIAGRAM
....................................................................46
PRINTED WIRING BOARDS
.......................................................47
SCHEMATIC DIAGRAMS (1/4)
...................................................50
SCH01_DIGITAL MCU&CD
.......................................................50
SCH02_DIGITAL-USB
...............................................................51
SCH03_INPUT
..........................................................................52
SCH04_MAIN
...........................................................................53
EXPLODED VIEW
f
.................................................................54
PACKING VIEW
.........................................................................55
SEMICONDUCTORS
..................................................................56
1. IC's
......................................................................................56
2. FL DISPLAY
.........................................................................76
CONTENTS
2