3. Hardware Configurations
Multiple options can be selected in the ETERNUS AF according to the customer's requirements. This chapter de-
scribes the installation conditions and standard installation rules for each component.
Configuration Schematics
The following diagrams show minimum and maximum configurations for ETERNUS AF storage systems.
■
Minimum Configuration
Figure 100 Minimum Configuration Diagram:
ETERNUS AF250 S2
CE
IOC
EXP
CPU
BUD
CA
CM#0
EXP
CPU
MemoryMemory
CA
IOC
CM#1
MP
BUD
PSU PSU
PANEL
BBU BBU
PANEL: Operation Panel
CE: Controller Enclosure
CM: Controller Module
CA: Channel Adapter
Host Interface
Memory: System Memory
BUD: Bootup and Utility Device
•
Backup area in case of power outage
•
Storage area for firmware
BBU: Battery Backup Unit
Backup power source in case of power outage
IOC: I/O Controller
Controller to control I/O
EXP: SAS Expander
Expander chip for SAS connections
MP: Mid Plane
Board that is located between the front of the enclosure and the rear of the enclosure (the controller
(CM) side)
149
FUJITSU Storage ETERNUS AF250 S2, ETERNUS AF250 All-Flash Arrays
Design Guide (Basic)
Copyright 2019 FUJITSU LIMITED
P3AG-1822-09ENZ0