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Fujitsu PRIMERGY RX200 S6 User Manual

Fujitsu PRIMERGY RX200 S6
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RX200 S6 Operating Manual 87
CSS components
8 CSS components
This chapter describes how to handle CSS components and how to identify
defective CSS components and replace them yourself.
I Further information on the CSS concept is provided in the "ServerView
Suite Local Service Concept - LSC" manual on the ServerView Suite
DVD 2.
For the latest information on optional products provided for the RX200 S6
see the configurator of the server:
http://ts.fujitsu.com/products/standard_servers/index.html
(for the EMEA market)
http://primeserver.fujitsu.com/primergy/system.html
(for the Japanese market)
V CAUTION!
Do not disassemble the power supply unit. Doing so may cause
electric shock.
Do not damage or modify internal cables or devices.Doing so may
cause a device failure, fire, or electric shock.
Devices inside the server remain hot after shutdown. Wait for a while
after shutdown before installing or removing internal options.
The circuit boards and soldered parts of internal options are exposed
and can be damaged by static electricity. Before handling them, first
touch a metal part of the server to discharge static electricity from
your body.
Do not touch the circuitry on boards or soldered parts. Hold the
metallic areas or the edges of the circuit boards.
If devices are installed or disassembled using methods other than
those outlined in this chapter, the warranty will be invalidated.
The installation indicated on this note is sometimes changed to the
kind of possible options without notice.
Follow the safety instructions in the chapter "Important information"
on page 29.

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Fujitsu PRIMERGY RX200 S6 Specifications

General IconGeneral
Tcase77.6 °C
Bus typeQPI
SteppingB1
FSB ParityNo
Processor codeSLBV4
Processor cache12 MB
Processor cores4
Processor modelE5620
System bus rate5.86 GT/s
Processor seriesIntel Xeon 5600 Series
Processor socketSocket B (LGA 1366)
Processor threads8
Processor codenameWestmere EP
Motherboard chipsetIntel® 5500
Number of QPI links2
Processor frequency2.4 GHz
Processor cache typeSmart Cache
Processor lithography32 nm
Processor manufacturerIntel
Processor package size42.5 X 45 mm
Processor front side bus- MHz
Processor boost frequency2.66 GHz
Processor operating modes64-bit
ECC supported by processorYes
Supported instruction setsSSE4.2
Thermal Design Power (TDP)80 W
Number of processors installed1
CPU multiplier (bus/core ratio)18
Physical Address Extension (PAE)40 bit
Memory types supported by processorDDR3 800/1066
Memory channels supported by processorTriple
Memory clock speeds supported by processor800, 1066 MHz
Memory bandwidth supported by processor (max)25.6 GB/s
Maximum internal memory supported by processor288 GB
HDD size2.5 \
RAID levels1, 5, 6
HDD capacity146 GB
HDD interfaceSerial Attached SCSI (SAS)
Optical drive type-
Total storage capacity292 GB
Memory slots12
Internal memory4 GB
Memory clock speed1066 MHz
Internal memory typeDDR3-SDRAM
Maximum internal memory192 GB
Maximum graphics card memory32 MB
LAN controllerIntel® 82575EB
USB 2.0 ports quantity7
Ethernet LAN (RJ-45) ports3
Drive bays8 x 2.5 \
Size (imperial)19 \
Dimensions (WxDxH)482.6 x 765 x 43 mm
Motherboard manufacturerD 3031
Recommended humidity operating range10 - 85 %
Recommended operating temperature range (T-T)10 - 35 °C
Power supply type47 - 63 Hz
Power requirements100 - 127 V / 200 - 240 V
Power consumption (typical)770 W
Power supply input frequency50 Hz
Compatible operating systemsMicrosoft Windows Server 2008 Microsoft Windows Server 2008 R2 (Hyper-V) Under Hyper-V are (et al): - Windows Server 2008 R2 - Windows Server 2008 - Windows Server 2003 - Windows Server 2000 Microsoft Windows Server 2003 R2 Novell SUSE Linux Enterprise Server Red Hat Enterprise Linux Citrix XenServer VMware Infrastructure VMware vSphere 4.0
Management platformiRMC S2
Chassis typeRack (1U)
CertificationISO 7779; ISO 9296
Processor ARK ID47925
Intel® Turbo Boost Technology1.0
Weight and Dimensions IconWeight and Dimensions
Weight17000 g

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