HP 54 Basic Cutter - Adjust Cutting Parameters; Set knife depth and pressure

IMPORTANT: In most cases, substrate calibration is not recommended for OPOS. If you perform the calibration
and results do not improve, reset the substrate calibration value to its default setting of 30 (see below).
1. Turn on the cutter and load the substrate with the calibration plot.
2.
Press .
3.
Press . System setup appears on the screen. Press .
4.
Press or until Calibrations appears on the screen, then press to conrm.
5.
Press or to scroll through the menu until you reach Cal media. Press . Measure appears on
the screen.
The cutter allows you to choose whether to measure the substrate or ll in a previously recorded value.
Press when nished.
NOTE: If a combination of substrate color and marker color has already been calibrated and recorded,
press and then . Now use , and to enter this value directly, without having to
measure it again. Press to conrm.
6.
Press again. The cutter lowers the sensor. Put the sensor on the white area appears on the screen.
7.
Use , , , and to maneuver the knife on top of a white area, which should be at least 3
× 3 cm (1.2 × 1.2 in).
8.
Press to conrm.
9.
Use , , , and to maneuver the knife on top of a black area, approximately in the
middle and slightly to the bottom right.
10.
Press to conrm. The cutter makes a circular movement while it measures the reection of the marker
color. It briey displays the measured values and then shows a value that is characteristic for this substrate
color and marker color combination. Store this value for future reference.
NOTE: An error message may appear if the sensor cannot dierentiate between black, grey, and white.
Make sure the test has been performed correctly. If OPOS cannot sense the markers, one of the manual
alignment methods must be used.
TIP: Remember to reset the calibration before printing on a standard substrate.
Adjust cutting parameters
Some parameters should be reset whenever a new substrate is loaded.
Set knife depth and pressure
1. Ensure that substrate is loaded in the cutter.
18 Chapter 3 Load the substrate ENWW