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General| Product Line | ProLiant |
|---|---|
| Rack Height | 2U |
| Processor Sockets | 2 |
| Memory | Up to 768 GB |
| RAID Levels | 0, 1, 5, 6, 10, 50, 60 |
| Management | HP iLO (Integrated Lights-Out) |
| Server Type | Rack |
| Processor | Intel Xeon E5-2600 series |
| Chipset | Intel C600 |
| Memory Slots | 24 |
| Memory Type | DDR3 |
| Drive Bays | 25 SFF |
| Hard Drive Interface | SAS, SATA |
| Network | Gigabit Ethernet |
| Power Supply | Redundant Power Supplies supported |
| Expansion Slots | 6 PCIe Gen3 slots |
| Operating System Support | Windows Server, Linux, VMware |
| Remote Management | HP iLO (Integrated Lights-Out) |
| Form Factor | Rackmount |
Details components on the server's front panel for SFF and LFF models.
Describes the status and function of front panel LEDs and buttons.
Instructions for accessing the Systems Insight Display on LFF servers.
Explains the LEDs on the Systems Insight Display and their status indicators.
Details LED combinations for system status and troubleshooting.
Identifies and describes components located on the server's rear panel.
Describes the status and function of rear panel LEDs and buttons.
Defines slot configurations for primary and secondary PCI riser cages.
Lists and identifies various connectors and components on the system board.
Explains the functions of the system maintenance switch positions.
Describes the NMI feature for crash dump logs and system analysis.
Illustrates DIMM slot numbering for processors and channel population guidelines.
Shows numbering for SFF, optional SFF, and LFF device bays.
Explains the status and meaning of drive LEDs for identification and status.
Describes the status indicators for LEDs on the PCI riser cage.
Details the interpretation of FBWC module LEDs (Amber, Green) for status.
Introduces hot-plug fans, with detailed information likely following.
Instructions on how to power up the server using the power button.
Describes methods for powering down the server, including controlled shutdown.
Steps to extend the server from its rack for maintenance.
Instructions for safely removing the server's access panel.
Steps for reinstalling the server's access panel after maintenance.
Instructions on accessing the rear panel of the server.
Steps for opening the cable management arm on the server.
Procedure for removing the hot-plug fan cage from the server.
Steps to remove a single hot-plug fan from the server.
Instructions for removing a full-length expansion board.
Procedure for safely removing the PCI riser cage.
Steps to install the PCI riser cage into the server.
Instructions for securing the full-length expansion board retainer.
Procedure for removing the air baffle from the server.
Information on HP Care Pack services for server setup and support.
Details on rack resource kits and documentation for installation.
Guidance on selecting a suitable environment for server installation.
Specifies clearances and airflow needs for server rack installation.
Outlines environmental temperature guidelines for server operation.
Discusses electrical regulations and requirements for server installation.
Details proper electrical grounding procedures for server safety.
Instructions for connecting a DC power cable to a DC power source.
Safety warnings and precautions related to rack installation and handling.
General advice for installing multiple hardware options and identifying steps.
Covers single- and dual-processor support and installation considerations.
Details memory types, speeds, and compatibility for the server.
Explains HP SmartMemory features, authentication, and performance benefits.
Describes the server's memory subsystem, channels, and DIMM slots.
Explains memory rank types and their configuration relevance.
Guides on identifying DIMM characteristics using labels and illustrations.
Details AMP modes, channel modes, and maximum memory capacities.
Explains Advanced ECC memory protection beyond standard ECC.
Describes how online spare memory protects against degraded DIMMs.
Explains lockstep mode for multi-bit memory error protection.
Provides rules for installing DIMMs across all AMP modes.
Step-by-step instructions for installing a DIMM into the server.
General guidelines for adding hot-plug hard drives to the server.
Procedure for installing hot-plug SAS or SATA hard drives.
Steps for removing hot-plug SAS or SATA hard drives from the server.
Discusses embedded and optional array controllers and FBWC support.
Instructions for installing the FBWC cache module.
Steps for installing the FBWC capacitor pack.
Covers the installation procedure for an optical drive.
Details the installation of redundant hot-plug power supplies.
Instructions for installing the FlexLOM adapter.
Introduction to PCI Express expansion boards and riser boards.
Procedure for removing expansion slot blanks from the chassis.
Steps for installing a half-length expansion board into the server.
Instructions for installing a full-length expansion board into the server.
Information on installing a secondary PCI riser cage, requiring two processors.
Details on installing the hard drive cage option and requirements.
Describes the 2U rack bezel for physical security and access.
Covers installing and enabling the Trusted Platform Module (TPM).
Step-by-step guide to installing the TPM board.
Illustrates SAS cabling for SFF and LFF drives, with optional cage.
Shows how to connect cables for the optical drive.
Diagrams for connecting FBWC cables for different drive configurations.
Details the chipset SATA cable option and its configuration limitations.
Instructions for connecting the 150W PCIe power cable.
Lists software utilities and their operational modes (online/offline).
Information on finding product specifications, options, and compatibility.
Overview of the embedded management features for server lifecycle.
Describes HP iLO subsystem features for server setup and administration.
Features of Active Health System for monitoring and diagnosing server issues.
Explains the IML for recording and viewing server events.
Details Intelligent Provisioning for server setup, OS install, and maintenance.
Describes HP Insight Diagnostics for server troubleshooting and repair validation.
Instructions for using the Erase Utility to reset system settings and drives.
Information on the Scripting Toolkit for unattended server deployments.
Details the SPP for firmware and system software updates.
Explains HP SUM for intelligent firmware and software deployment.
Describes RBSU for configuring system devices, features, and options.
Guide to using RBSU with specific keys for navigation and configuration.
Explains the automatic system configuration during initial boot.
Describes the boot options screen and available actions during startup.
Details Advanced Memory Protection (AMP) modes like Advanced ECC.
Instructions for re-entering serial and product IDs after system board replacement.
Information on ACU for managing storage arrays and configurations.
Explains ORCA utility for creating logical drives and RAID configurations.
Describes ROMPaq utility for upgrading system firmware (BIOS).
Explains ASR feature for system restarts after OS errors.
Details standard and legacy USB support for the server.
Describes redundant ROM support for safe firmware upgrades.
Guidance on updating drivers and software for optimal system performance.
Importance of updating drivers and how to obtain them.
Best practices for updating server software and firmware.
Information on VCRM and VCA for managing software update tasks.
Information on supported OS and virtualization software for ProLiant servers.
Overview of HP Technology Services for support and consultancy.
Information on HP notifications for upcoming hardware/software changes.
Lists guides and resources for troubleshooting ProLiant servers and error messages.
Explains regulatory model numbers for product identification and compliance.
FCC Part 15 rules for RF emission limits for Class A and Class B devices.
How to interpret the FCC rating label for device classification.
Compliance statement for Class A digital devices under FCC rules.
Compliance statement for Class B digital devices under FCC rules.
FCC conformity declaration for products sold in the US.
FCC notification regarding changes or modifications to the device.
Requirements for using shielded cables for FCC compliance.
Compliance information for Class A equipment in Canada.
Information on EU directives and CE marking compliance.
Guidance on proper disposal of electronic waste in the EU.
Regulatory notice specific to Japan regarding electronic equipment.
Regulatory compliance notice from Taiwan's Bureau of Standards, Metrology & Inspection.
Regulatory compliance notice for Class A equipment in Korea.
Regulatory compliance notice for Class A equipment in China.
Safety information regarding laser products, including Class 1 lasers.
Warnings and safety precautions for battery replacement.
Precautions to prevent system damage from static electricity.
Methods for proper grounding to prevent ESD damage.
Details temperature, humidity, and altitude specifications for the server.
Provides dimensions and weight specifications for the server.
Lists specifications for various HP power supply options.
Information to have ready before contacting HP support.
Contact details for HP support in the US and worldwide.
Explains HP's Customer Self Repair program and part categories.
