Huawei SE2900 - Page 75

HUAWEI SE2900 Session Border Controller
Hardware Description
1 Service Processing Device
Issue 01 (2016-01-15)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
71
Figure 1-53 Hardware structure
Table 1-47 describes the components of the VPUA0.
Table 1-47 Components
No.
Compone
nt
Quantity
Description
1
Solid-state
drive (SSD)
1
The SSD stores the operating system (OS) and field
programmable gate array (FPGA) files.
2
Baseboard
managemen
t controller
(BMC)
1
The BMC, a processing module independent of the
CPU, implements board management and provides
interfaces and buses, such as system interfaces,
General Purpose Input/Output (GPIO), serial ports,
and Inter-Integrated Circuit (I2C) bus.
3
CPU
1
The board uses one Intel
®
Xeon
®
full-power, 6-core
Ivy Bridge-EN CPU.
4
Heat sink
1
The heat sink is used to cool the CPU.
5
Cover
1
The metal cover is used to protect the components